Invention Application
- Patent Title: Structure for sputtering an anti-reflection layer onto a board at low temperature and a manufacturing method
- Patent Title (中): 在低温下将抗反射层溅射到板上的结构和制造方法
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Application No.: US11358090Application Date: 2006-02-22
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Publication No.: US20070193876A1Publication Date: 2007-08-23
- Inventor: Jau-Jier Chu , Hsu-Fu Hung , I-Wen Lee , Chien-Min Weng , Chao-Lan Lee
- Applicant: Jau-Jier Chu , Hsu-Fu Hung , I-Wen Lee , Chien-Min Weng , Chao-Lan Lee
- Main IPC: C23C14/32
- IPC: C23C14/32 ; B32B9/04

Abstract:
A manufacturing method for sputtering an anti-refection layer onto a board at low temperature has the merits of easily being implemented and easily mass-produced. The manufacturing method is used for sputtering multiple anti-refection layers onto a board. The method can be used for mass-producing anti-reflection panels as the raw material for the photo industry. The method is superior to the manufacturing method for producing nebulization anti-reflection panels. This invention utilizes the anti-reflection characteristics of the board structure that is sputtered and stacked alternatively with high index refraction layers and low index refraction layers. A continuous manufacturing process is adopted. The present invention uses plasma to clean the surface of the boards and adopts a traditional sputtering machine. Therefore, it is convenient for installing and mass-producing high quality material.
Information query
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