A Light Emitting Diode (LED) package including a carrier, a package housing, an LED chip, and an electrostatic discharge protector (ESD protector) is provided. The package housing encapsulates a part of the carrier so as to provide a chip-accommodating space on the carrier. The LED chip disposed on the carrier and located in the chip-accommodating space is electrically connected to the carrier. The ESD protector disposed on the carrier and encapsulated by the package housing is electrically connected to the carrier. The LED package has excellent light-emitting intensity, since the light emitted from the LED chip is not absorbed by the ESD protector encapsulated by the package housing. Additionally, a fabricating method of the LED package is also provided.