公开(公告)号：US20120170288A1

公开(公告)日：2012-07-05

申请号：US13244670

申请日：2011-09-25

申请人： Kou-Rueh Lai ,  Tung-Hsing Tsou ,  Ren-Zong Chen

发明人： Kou-Rueh Lai ,  Tung-Hsing Tsou ,  Ren-Zong Chen

IPC分类号： F21V29/00 ,  H01J9/00

CPC分类号： F21K9/90 ,  F21K9/232 ,  F21V3/00 ,  F21Y2107/00 ,  F21Y2115/10

摘要： A structure of a light emitting diode (LED) lamp and a method for fabricating the same are provided. In the structure of the LED lamp, LEDs are designed to approach an inner surface of a lampshade more closely, so that the LED lamp has high brightness and high light-utilization efficiency. The above-mentioned structure and method facilitate the mass-production of the LED lamp.

摘要翻译： 提供了一种发光二极管（LED）灯的结构及其制造方法。 在LED灯的结构中，LED被设计成更接近灯罩的内表面，使得LED灯具有高亮度和高的光利用效率。 上述结构和方法有利于大量生产LED灯。

公开(公告)号：US20090026470A1

公开(公告)日：2009-01-29

申请号：US11781279

申请日：2007-07-23

申请人： Kou-Rueh Lai ,  Kung-Chi Ho ,  Hu-Chen Tsai ,  Po-Kai Huang ,  Ming-Sing Lai

发明人： Kou-Rueh Lai ,  Kung-Chi Ho ,  Hu-Chen Tsai ,  Po-Kai Huang ,  Ming-Sing Lai

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/44 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A fabrication method of a side-view LED package is provided. A chip carrier is provided. An opaque housing is bonded with the chip carrier. An LED chip electrically connects the chip carrier by performing a chip-bonding process and the opaque housing has a cavity for accommodating the LED chip. A transparent encapsulant is disposed in the cavity wherein the transparent encapsulant has a side-view light output surface uncovered by the opaque housing and light emitted from the LED chip is output via the side-view light output surface. A portion of the opaque housing and a portion of the transparent encapsulant are removed for reducing an overall thickness of the opaque housing such that a top surface of the transparent encapsulant is uncovered by the opaque housing beside the side-view light output surface. An opaque protective layer is formed on the top surface of the transparent encapsulant and the opaque housing.

摘要翻译： 提供了一种侧视LED封装的制造方法。 提供芯片载体。 不透明的壳体与芯片载体结合。 LED芯片通过执行芯片接合工艺来电连接芯片载体，并且不透明壳体具有用于容纳LED芯片的空腔。 透明密封剂设置在空腔中，其中透明密封剂具有未被不透明外壳覆盖的侧视光输出表面，并且经由侧视光输出表面输出从LED芯片发出的光。 除去不透明壳体的一部分和透明密封剂的一部分以减小不透明壳体的总体厚度，使得透明密封剂的顶表面被侧视光输出表面旁边的不透明壳体覆盖。 在透明密封剂和不透明壳体的顶表面上形成不透明的保护层。

公开(公告)号：US20070194422A1

公开(公告)日：2007-08-23

申请号：US11535991

申请日：2006-09-28

申请人： Kou-Rueh Lai ,  Gwo-Shii Yang ,  Kung-Chi Ho ,  Hu-Chen Tsai ,  Wen-Chuan Wang

发明人： Kou-Rueh Lai ,  Gwo-Shii Yang ,  Kung-Chi Ho ,  Hu-Chen Tsai ,  Wen-Chuan Wang

IPC分类号： H01L23/06

CPC分类号： H01L25/167 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A Light Emitting Diode (LED) package including a carrier, a package housing, an LED chip, and an electrostatic discharge protector (ESD protector) is provided. The package housing encapsulates a part of the carrier so as to provide a chip-accommodating space on the carrier. The LED chip disposed on the carrier and located in the chip-accommodating space is electrically connected to the carrier. The ESD protector disposed on the carrier and encapsulated by the package housing is electrically connected to the carrier. The LED package has excellent light-emitting intensity, since the light emitted from the LED chip is not absorbed by the ESD protector encapsulated by the package housing. Additionally, a fabricating method of the LED package is also provided.

摘要翻译： 提供了包括载体，封装壳体，LED芯片和静电放电保护器（ESD保护器）的发光二极管（LED）封装。 封装壳体封装载体的一部分，以便在载体上提供芯片容纳空间。 设置在载体上并且位于芯片容纳空间中的LED芯片电连接到载体。 设置在载体上并被封装壳体封装的ESD保护器电连接到载体。 LED封装具有优异的发光强度，因为从LED芯片发出的光不被由封装壳体封装的ESD保护器吸收。 此外，还提供了LED封装的制造方法。

公开(公告)号：US20120169251A1

公开(公告)日：2012-07-05

申请号：US13110002

申请日：2011-05-18

申请人： Kou-Rueh Lai ,  Kung-Chi Ho

发明人： Kou-Rueh Lai ,  Kung-Chi Ho

IPC分类号： H05B37/02 ,  H01K1/30 ,  H01J9/24

CPC分类号： F21K9/90 ,  F21K9/232 ,  F21V3/00 ,  F21Y2103/10 ,  F21Y2107/00 ,  F21Y2115/10

摘要： A structure of a light emitting diode (LED) lamp and a method for fabricating the same are provided. In the structure of the LED lamp, LEDs are designed to approach an inner surface of a lampshade more closely, so that the LED lamp has high brightness and high light-use efficiency. The method for fabricating the LED lamp includes the following steps. First, a holder is provided and at least one flexible LED light bar is assembled on the holder. The flexible LED light bar is then forced to approach the holder, and the flexible LED light bar as well as the holder are inserted into the lampshade. After the flexible LED light bar and the holder are inserted into the lampshade, the flexible LED light bar is bent outward to approach the inner surface of the lampshade. After that, the holder and the lampshade are assembled on a socket.

摘要翻译： 提供了一种发光二极管（LED）灯的结构及其制造方法。 在LED灯的结构中，LED被设计成更接近灯罩的内表面，使得LED灯具有高亮度和高的光利用效率。 制造LED灯的方法包括以下步骤。 首先，设置保持器，并且在支架上组装至少一个柔性LED灯条。 柔性LED灯条然后被迫接近保持器，柔性LED灯条以及支架插入灯罩中。 柔性LED灯条和灯座插入灯罩后，柔性LED灯条向外弯曲，接近灯罩内表面。 之后，将支架和灯罩组装在插座上。

公开(公告)号：US20100084683A1

公开(公告)日：2010-04-08

申请号：US12632737

申请日：2009-12-07

申请人： Kou-Rueh Lai ,  Gwo-Shii Yang ,  Kung-Chi Ho ,  Hu-Chen Tsai ,  Wen-Chuan Wang

发明人： Kou-Rueh Lai ,  Gwo-Shii Yang ,  Kung-Chi Ho ,  Hu-Chen Tsai ,  Wen-Chuan Wang

IPC分类号： H01L33/00 ,  H01L21/50

CPC分类号： H01L25/167 ,  H01L2224/04042 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： A light emitting diode (LED) package is provided. The LED package includes a carrier, a package housing, a strength enhancement structure, an ESD protector and an LED chip. The carrier has a first surface and a second surface. The carrier includes a first electrode and a second electrode, wherein a gap is between the first electrode and the second electrode. The package housing is disposed on the carrier and has a first aperture and a second aperture. The first surface is exposed by the first aperture while the second surface is exposed by the second aperture. The strength enhancement structure is disposed at the gap. The ESD protector is disposed on the carrier and located within the second aperture. The LED chip is disposed on the carrier and located within the first aperture, wherein the ESD protector and the LED chip is electrically connected to the carrier.

摘要翻译： 提供了一种发光二极管（LED）封装。 LED封装包括载体，封装外壳，强度增强结构，ESD保护器和LED芯片。 载体具有第一表面和第二表面。 载体包括第一电极和第二电极，其中间隙在第一电极和第二电极之间。 包装壳体设置在载体上并具有第一孔和第二孔。 第一表面由第一孔暴露，而第二表面被第二孔露出。 强度增强结构设置在间隙处。 ESD保护器设置在载体上并且位于第二孔内。 LED芯片设置在载体上并且位于第一孔内，其中ESD保护器和LED芯片电连接到载体。