An object of the present invention is to economically produce a resin composition pellet with the degradation of resin suppressed, by using an ordinary extruder, the resin composition pellet being filled with a desired filling amount of a uniformly compounded fibrous filler, and having a required weight average fiber length, in particular, to produce a resin composition pellet used for a socket of a planar socket pin in which the pitch interval of a lattice area of a semiconductor device is 2.0 mm or less, the thickness of the lattice area is 0.5 mm or less, and the height of the socket is 5.0 mm or less. To achieve the object, in supplying 80 to 55% by weight of resin and 20 to 45% by weight of the fibrous filler with a weight average fiber length of 1 mm or more to an extruder to produce a resin composition pellet in which a weight average fiber length of a fibrous filler is 180 to 360 μm, a part of an amount (x) of the resin is supplied through a main feed port of the extruder, and the fibrous filler and a remaining amount (1−x) of the resin are supplied through a side-feed port so that x/(1−x) becomes 50/50 to 10/90% by weight.