发明申请
- 专利标题： METHOD OF FABRICATING ULTRA THIN FLIP-CHIP PACKAGE
- 专利标题（中）： 制造超薄薄片包装的方法
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申请号： US11691067申请日： 2007-03-26
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公开(公告)号： US20070200251A1公开(公告)日： 2007-08-30
- 发明人: Soon-Bum KIM , Se-Young JEONG , Se-Yong OH , Nam-Seog KIM
- 申请人： Soon-Bum KIM , Se-Young JEONG , Se-Yong OH , Nam-Seog KIM
- 申请人地址： KR Gyeonggi-do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR2003-74660 20031024
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
Provided is a method of fabricating an ultra thin flip-chip package. In the above method, an under barrier metal film is formed on a bond pad of a semiconductor chip. Three-dimensional structured solder bumps are formed on the under barrier metal film. each of the solder bumps including a bar portion and a ball portion disposed at an end of the bar portion. The semiconductor chip including the three-dimensional structured solder bumps is bonded to a solder layer on a printed circuit board to complete a flip-chip package. According to the present invention, by employing the three-dimensional structured solder bumps, it is possible to lower the height of the solder bumps, thereby improving the reliability of an ultra thin flip-chip package.
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