- 专利标题: Electron beam apparatus with detailed observation function and sample inspecting and observing method using electron beam apparatus
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申请号: US11723591申请日: 2007-03-21
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公开(公告)号: US20070200569A1公开(公告)日: 2007-08-30
- 发明人: Kenji Watanabe , Tohru Satake , Nobuharu Noji , Takeshi Murakami , Tsutomu Karimata , Yuichiro Yamazaki , Ichirota Nagahama , Atsushi Onishi
- 申请人: Kenji Watanabe , Tohru Satake , Nobuharu Noji , Takeshi Murakami , Tsutomu Karimata , Yuichiro Yamazaki , Ichirota Nagahama , Atsushi Onishi
- 申请人地址: JP Tokyo JP Tokyo
- 专利权人: Ebara Corporation,Kabushiki Kaisha Toshiba
- 当前专利权人: Ebara Corporation,Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo JP Tokyo
- 优先权: JP2003-429926 20031225
- 主分类号: G01R31/305
- IPC分类号: G01R31/305
摘要:
Provided is a sample observing method allowing for a detailed observation of a sample by using one and the same electron beam apparatus. The method uses an electron beam apparatus 1 comprising a primary optical system 10 serving for irradiating the electron beam onto the sample surface and a secondary optical system 30 serving for detecting secondary electrons emanating from said sample surface to form an image of the sample surface. The inspection is carried out on the sample surface, S, by irradiating the electron beam to the sample surface, and after the extraction of a defective region in the sample based on the inspection, the extracted defective region is once again applied with the irradiation of the electron beam so as to provide a magnification or a detailed observation of the defective region.
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