Packing material for separation of optical isomer and method of separating optical isomer with the same
    1.
    发明授权
    Packing material for separation of optical isomer and method of separating optical isomer with the same 有权
    用于分离光学异构体的包装材料和与其分离光学异构体的方法

    公开(公告)号:US07399409B2

    公开(公告)日:2008-07-15

    申请号:US10398937

    申请日:2001-10-12

    IPC分类号: B01D15/08

    摘要: The objectives of this invention are to provide a filler for separating optical isomers, capable of efficiently carrying out optical resolution of optical isomer mixtures, and to provide a process for separating optical isomers by a simulated moving bed chromatography utilizing the filler. This invention provides a filler made of a carrier supporting a specific amount of an optically active high molecular weight compound. Separation by the simulated moving bed chromatography using the filler is carried out under the condition that the capacity factors have specific values.

    摘要翻译: 本发明的目的是提供一种用于分离光学异构体的填料,其能够有效地进行光学异构体混合物的光学拆分,并提供通过使用填料的模拟移动床色谱分离光学异构体的方法。 本发明提供了由支持特定量的光学活性高分子量化合物的载体制成的填料。 在容量因子具有特定值的条件下,通过使用填料的模拟移动床层析法进行分离。

    Substrate inspection apparatus, substrate inspection method and semiconductor device manufacturing method
    3.
    发明申请
    Substrate inspection apparatus, substrate inspection method and semiconductor device manufacturing method 失效
    基板检查装置,基板检查方法及半导体装置的制造方法

    公开(公告)号:US20070194232A1

    公开(公告)日:2007-08-23

    申请号:US11698132

    申请日:2007-01-26

    IPC分类号: G21K7/00

    摘要: A substrate inspection apparatus includes: an electron gun which generates an electron beam to irradiate the electron beam to a substrate; an electron detection unit which detects at least one of a secondary electron, a reflection electron and a back scattering electron generated from a surface of the substrate by the irradiation of the electron beam to output signals constituting an image showing a state of the substrate surface; and a surface potential uniformizing unit which generates ions, and irradiates the ions to the substrate before the irradiation of the electron beam to uniformize a surface potential of the substrate.

    摘要翻译: 基板检查装置包括:电子枪,其产生电子束以将电子束照射到基板; 电子检测单元,其通过电子束的照射检测从基板的表面产生的二次电子,反射电子和背散射电子中的至少一个,以输出构成表示基板表面的状态的图像的信号; 以及产生离子的表面电位均匀化单元,并且在照射电子束之前将离子照射到基板上以使基板的表面电位均匀化。

    Process for producing packing for resolving optical isomers
    4.
    发明授权
    Process for producing packing for resolving optical isomers 失效
    用于生产用于分解光学异构体的填料的方法

    公开(公告)号:US07258794B2

    公开(公告)日:2007-08-21

    申请号:US10529698

    申请日:2003-10-09

    IPC分类号: B01D15/08

    摘要: The present invention provides a production method with which a porous carrier can be allowed to evenly carry a polysaccharide derivative. That is, the present invention provides a method of producing an enantiomeric isomer-separating filler, including bringing a porous carrier and a solution of a polysaccharide derivative into contact with each other through a stirring operation in a stirring device, to allow the porous carrier to carry an optically active polymer compound, in which: a two-axis vertical stirring device is used as the stirring device; and the porous carrier is allowed to carry the polysaccharide derivative in a carrying amount of 23 mass % or more.

    摘要翻译: 本发明提供可以使多孔载体均匀地携带多糖衍生物的制备方法。 也就是说,本发明提供一种制备对映体异构体分离填料的方法,包括使多糖载体和多糖衍生物的溶液通过搅拌装置中的搅拌操作彼此接触,以使多孔载体 携带光学活性高分子化合物,其中使用两轴垂直搅拌装置作为搅拌装置; 允许多孔载体携带23质量%以上的载体量的多糖衍生物。

    Substrate inspection method, method of manufacturing semiconductor device, and substrate inspection apparatus
    7.
    发明授权
    Substrate inspection method, method of manufacturing semiconductor device, and substrate inspection apparatus 有权
    基板检查方法,半导体装置的制造方法以及基板检查装置

    公开(公告)号:US07645988B2

    公开(公告)日:2010-01-12

    申请号:US11137473

    申请日:2005-05-26

    IPC分类号: G21K7/00

    摘要: A substrate inspection method includes: generating an electron beam and irradiating the electron beam as a primary electron beam to a substrate as a specimen; inducing at least any of a secondary electron, a reflected electron and a backscattering electron which are emitted from the substrate receiving the primary electron beam, and magnifying and projecting the induced electron as a secondary electron beam so as to form an image of the secondary electron beam; a trajectory of the primary electron beam and a trajectory of the secondary electron beam having an overlapping space and space charge effect of the secondary electron beam occurring in the overlapping space, detecting the image of the secondary electron beam to output a signal representing a state of the substrate; and suppressing aberration caused by the space charge effect in the overlapping space.

    摘要翻译: 基板检查方法包括:产生电子束并将作为一次电子束的电子束照射到作为检体的基板; 诱导从接收一次电子束的基板发射的二次电子,反射电子和后向散射电子中的任一种,并且将感应电子放大并投影为二次电子束,以形成二次电子的图像 光束; 一次电子束的轨迹和二次电子束的轨迹具有在重叠空间中发生的二次电子束的重叠的空间和空间电荷效应,检测二次电子束的图像以输出表示状态的信号 基材; 并且抑制由重叠空间中的空间电荷效应引起的像差。

    Defect inspecting apparatus for semiconductor wafer
    8.
    发明授权
    Defect inspecting apparatus for semiconductor wafer 有权
    半导体晶圆缺陷检查装置

    公开(公告)号:US07512501B2

    公开(公告)日:2009-03-31

    申请号:US11889765

    申请日:2007-08-16

    IPC分类号: G01B5/28 G01B5/30

    CPC分类号: G01N21/95607 G01N21/8851

    摘要: A defect inspecting apparatus comprising: an inspection region dividing section which divides a defect inspection region of a wafer on which a circuit pattern is formed into a plurality of inspection subregions; a pattern density calculating section which calculates the pattern density of each of the inspection subregions on the basis of design data of the circuit pattern; an inspection execution region and sensitivity rank setting section which assigns a sensitivity rank based on the pattern density to a plurality of inspection execution regions, each including a plurality of the inspection subregions; and a defect inspecting section which sets an inspection parameter on the basis of sensitivity ranks of the inspection execution regions and inspects the inspection execution regions for a defect.

    摘要翻译: 一种缺陷检查装置,包括:检查区域分割部,其将形成有电路图案的晶片的缺陷检查区域分割成多个检查次数; 图案密度计算部,其基于所述电路图案的设计数据来计算所述检查子区域中的图案密度; 检查执行区域和灵敏度等级设置部分,其将多个检查执行区域分配给多个检查执行区域,每个检查执行区域包括多个检查子区域; 以及缺陷检查部,其根据检查执行区域的灵敏度等级设定检查参数,并检查检查执行区域的缺陷。

    Defect inspecting apparatus, defect inspecting method, semiconductor device manufacturing system, and semiconductor device manufacturing method
    10.
    发明申请
    Defect inspecting apparatus, defect inspecting method, semiconductor device manufacturing system, and semiconductor device manufacturing method 有权
    缺陷检查装置,缺陷检查方法,半导体装置制造系统和半导体装置制造方法

    公开(公告)号:US20080052021A1

    公开(公告)日:2008-02-28

    申请号:US11889765

    申请日:2007-08-16

    IPC分类号: G06F19/00

    CPC分类号: G01N21/95607 G01N21/8851

    摘要: A defect inspecting apparatus comprising: an inspection region dividing section which divides a defect inspection region of a wafer on which a circuit pattern is formed into a plurality of inspection subregions; a pattern density calculating section which calculates the pattern density of each of the inspection subregions on the basis of design data of the circuit pattern; an inspection execution region and sensitivity rank setting section which assigns a sensitivity rank based on the pattern density to a plurality of inspection execution regions, each including a plurality of the inspection subregions; and a defect inspecting section which sets an inspection parameter on the basis of sensitivity ranks of the inspection execution regions and inspects the inspection execution regions for a defect.

    摘要翻译: 1.一种缺陷检查装置,包括:检查区域分割部,其将形成有电路图案的晶片的缺陷检查区域分割成多个检查次数; 图案密度计算部,其基于所述电路图案的设计数据来计算所述检查子区域中的图案密度; 检查执行区域和灵敏度等级设置部分,其将多个检查执行区域分配给多个检查执行区域,每个检查执行区域包括多个检查子区域; 以及缺陷检查部,其根据检查执行区域的灵敏度等级设定检查参数,并检查检查执行区域的缺陷。