An apparatus, system, and method are disclosed for efficient heat dissipation. The apparatus for efficient heat dissipation is provided with a compliant heat pipe configured to conform to adjacent surfaces under a compressive load, a compression member configured to apply the compressive load to the compliant heat pipe, and wherein the compliant heat pipe conforms to the surface of the compression member and the surface of a heat source under the compressive load. Beneficially, such an apparatus, system, and method would provide efficient heat dissipation through effective thermo-coupling between the heat source and the heat pipe. Additionally, the apparatus, system, and method would facilitate the application of a load to thermal grease for further improvements on thermo-coupling between the heat source and the heat pipe.