公开(公告)号：US20070178255A1

公开(公告)日：2007-08-02

申请号：US11343673

申请日：2006-01-31

Applicant: Timothy Farrow ,  Dean Herring

Inventor： Timothy Farrow ,  Dean Herring

IPC: B41M5/40

CPC classification number: H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus, system, and method are disclosed for thermal conduction interfacing. The apparatus for thermal conduction interfacing is provided with a first layer formed substantially of a pliable thermally conductive material. The apparatus includes a second layer formed substantially of a pliable thermally conductive material and coupled at the edges to the first layer forming a pliable packet, wherein the first layer and the second layer conform to a set of thermal interface surfaces. Additionally, the apparatus includes a plurality of thermally conductive particles disposed within the packet, wherein thermal energy is transferred from the first layer to the second layer through the thermally conductive particles. Beneficially, such an apparatus, system, and method would provide effective thermal coupling between a heat generating device and a heat dissipating device. Additionally, the apparatus, system, and method would be modular, reusable, and easy to install or replace without a significant mess.

Abstract translation: 公开了用于热传导接口的装置，系统和方法。 用于热传导接口的装置设置有基本由柔性导热材料形成的第一层。 该装置包括基本上由柔性导热材料形成的第二层，并且在边缘处连接到形成柔软包装的第一层，其中第一层和第二层符合一组热界面。 另外，该装置包括设置在分组内的多个导热颗粒，其中热能通过导热颗粒从第一层转移到第二层。 有利地，这种装置，系统和方法将在发热装置和散热装置之间提供有效的热耦合。 此外，装置，系统和方法将是模块化的，可重复使用的，并且易于安装或更换，而没有显着的混乱。

公开(公告)号：US20050133203A1

公开(公告)日：2005-06-23

申请号：US10745039

申请日：2003-12-22

Applicant: Timothy Farrow ,  Michael June ,  Albert Makley

Inventor： Timothy Farrow ,  Michael June ,  Albert Makley

IPC: F28F5/00 ,  H01L23/473 ,  H05K7/20

CPC classification number: H01L23/473 ,  F28D2015/0291 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat removal system for a computer has a heat sink and a spool rotatably disposed in the heat sink. The spool includes fluid inlets and outlets, and water circulates in a closed loop from the inlets, through the spool, through the outlets, past the computer component to be cooled, and between the heat sink and the spool to transfer heat to the heat sink, then back to the inlets. A thermally conductive can is between the heat sink and spool such that the working fluid flows between the can and spool.

Abstract translation: 用于计算机的散热系统具有散热器和可旋转地设置在散热器中的线轴。 阀芯包括流体入口和出口，并且水从入口，通过阀芯，通过出口，经过待冷却的计算机部件以及散热器和阀芯之间的闭环循环，以将热量传递到散热器 ，然后回到入口处。 导热罐在散热器和阀芯之间，使得工作流体在罐和阀芯之间流动。

公开(公告)号：US20050270744A1

公开(公告)日：2005-12-08

申请号：US10860683

申请日：2004-06-03

Applicant: Timothy Farrow ,  Albert Makley

Inventor： Timothy Farrow ,  Albert Makley

IPC: H01L23/367 ,  H01L23/42 ,  H05K7/20

CPC classification number: H01L23/42 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thin metallic sheet having an array of alternating domes, directed away from opposite sides of the sheet, to bridge a gap between a top surface of a processor package and a bottom surface of a heat sink. The sheet is positioned between the processor package and heat sink before securing the heat sink to the processor package. By pressing the processor package and heat sink together, the tops of the domes flatten out to maximize surface contact between a first side of the sheet and the top of the processor package, and between a second side of the sheet and the top of the heat sink.

Abstract translation: 具有交替的圆顶阵列的薄金属片，其指向远离片材的相对侧，以桥接处理器封装的顶表面和散热器的底表面之间的间隙。 在将散热器固定到处理器封装之前，该片材位于处理器封装和散热器之间。 通过将处理器封装和散热器压在一起，将圆顶的顶部平坦化以最大化片材的第一面与处理器封装的顶部之间以及片材的第二面与热的顶部之间的表面接触 水槽。

公开(公告)号：US20070246018A1

公开(公告)日：2007-10-25

申请号：US11379458

申请日：2006-04-20

Applicant: Timothy Farrow ,  Barry Brinks

Inventor： Timothy Farrow ,  Barry Brinks

IPC: F02M51/00 ,  F02M7/24 ,  F02B23/00

CPC classification number: F02D19/022 ,  F02D19/023 ,  F02D41/0027 ,  F02M21/0212 ,  F02M21/06 ,  Y02T10/32

Abstract: A trim system for controlling an equivalence ratio in a fuel system is provided. The fuel system includes an air duct, a mixer disposed in the air duct, and a converter. The mixer has a reference pressure port and an air valve vacuum port. The converter has an outlet port and a bias port. The trim system comprises the mixer, the converter, a balance line, one or more orifices, and first and second trim valves. The outlet port is operably coupled to the mixer to deliver vaporized fuel to the mixer. The balance line is operably coupled to the reference pressure port, the bias port, and the air valve vacuum port. The balance line provides pressure to the bias port. The first and second trim valves are disposed in the balance line and operable such that the equivalence ratio in the fuel system is controlled.

Abstract translation: 提供了一种用于控制燃料系统中的当量比的装饰系统。 燃料系统包括空气管道，设置在空气管道中的混合器和转换器。 混合器具有参考压力端口和空气阀真空端口。 转换器有一个出口和一个偏置端口。 修剪系统包括混合器，转换器，平衡管线，一个或多个孔口以及第一和第二调节阀。 出口端口可操作地耦合到混合器以将蒸发的燃料输送到混合器。 平衡线可操作地耦合到参考压力端口，偏压端口和空气阀真空端口。 平衡线为偏压端口提供压力。 第一和第二调节阀设置在平衡管线中并且可操作使得控制燃料系统中的当量比。

公开(公告)号：US20070201206A1

公开(公告)日：2007-08-30

申请号：US11364321

申请日：2006-02-28

Applicant: Timothy Farrow ,  Dean Herring

Inventor： Timothy Farrow ,  Dean Herring

IPC: H05K7/20

CPC classification number: H01L23/427 ,  H01L23/4006 ,  H01L2023/4056 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus, system, and method are disclosed for efficient heat dissipation. The apparatus for efficient heat dissipation is provided with a compliant heat pipe configured to conform to adjacent surfaces under a compressive load, a compression member configured to apply the compressive load to the compliant heat pipe, and wherein the compliant heat pipe conforms to the surface of the compression member and the surface of a heat source under the compressive load. Beneficially, such an apparatus, system, and method would provide efficient heat dissipation through effective thermo-coupling between the heat source and the heat pipe. Additionally, the apparatus, system, and method would facilitate the application of a load to thermal grease for further improvements on thermo-coupling between the heat source and the heat pipe.

Abstract translation: 公开了一种用于有效散热的装置，系统和方法。 具有有效散热的装置设置有配置成在压缩载荷下与相邻表面一致的柔性热管，被构造成将压缩载荷施加到柔性热管上的压缩构件，并且其中柔性热管符合 压缩构件和压缩载荷下的热源表面。 有利地，这种设备，系统和方法将通过热源和热管之间的有效热耦合来提供有效的散热。 此外，装置，系统和方法将有助于将负载施加到导热油脂上，以进一步改进热源和热管之间的热耦合。

公开(公告)号：US20050280999A1

公开(公告)日：2005-12-22

申请号：US10871661

申请日：2004-06-18

Applicant: Timothy Farrow ,  Dean Herring ,  William Martin-Otto

Inventor： Timothy Farrow ,  Dean Herring ,  William Martin-Otto

IPC: H01L23/40 ,  H05K7/20

CPC classification number: H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44026 ,  Y10T24/44496 ,  H01L2924/00

Abstract: A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that has two loops. When the rotatable wire form is rotated, the two loops press against an impingement shelf on the heat sink, forcing the heat sink against the retention module and the computer chip. The two loops are angularly offset to each other, thus compensating for torsion lag between the two loops when the two loops are pressed against the impingement shelf.

Abstract translation: 保持模块可牢固地固定计算机芯片的散热片。 保持模块围绕电路板上的计算机芯片定向。 保持模块具有可旋转的线形，其具有两个环。 当可旋转线形式旋转时，两个环路压靠在散热器上的冲击架上，迫使散热器抵靠保持模块和计算机芯片。 两个回路相互成角度地偏移，从而补偿当两个回路压靠冲击架时两个回路之间的扭转滞后。

公开(公告)号：US20050248924A1

公开(公告)日：2005-11-10

申请号：US10842305

申请日：2004-05-10

Applicant: Timothy Farrow ,  Albert Makley

Inventor： Timothy Farrow ,  Albert Makley

IPC: H01L23/433 ,  H05K7/20

CPC classification number: H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermal interface made up of a sheet having an array of alternating pivoting sections, each section having a first end directed away from a first side of the sheet and a second end directed away from the opposite side of the sheet, to bridge a gap between a top surface of a processor package and a bottom surface of a heat sink. The sheet is positioned between the processor package and heat sink before securing the heat sink to the processor package. By pressing the processor package and heat sink together, the pivoting sections press against the two surfaces of the processor package and the heat sink to provide a mechanical pressure interface that promotes thermal conduction between the surfaces. In a preferred embodiment, the sheet also has alternating side cantilever panels that provide additional pressure contacts.

Abstract translation: 一种热接口，其由具有交替的枢转部分阵列的片材组成，每个部分具有远离片材的第一侧的第一端和远离片材的相对侧的第二端， 处理器封装的顶表面和散热器的底表面。 在将散热器固定到处理器封装之前，该片材位于处理器封装和散热器之间。 通过将处理器封装和散热器压在一起，枢转部分压靠处理器封装和散热器的两个表面，以提供促进表面之间的热传导的机械压力界面。 在优选实施例中，片材还具有交替的侧悬臂板，其提供额外的压力接触。

公开(公告)号：US20050281001A1

公开(公告)日：2005-12-22

申请号：US10871719

申请日：2004-06-18

Applicant: Karl Dittus ,  Timothy Farrow ,  Walter Goodman ,  Dean Herring ,  William Martin-Otto ,  Rodrigo Samper ,  John Scavuzzo

Inventor： Karl Dittus ,  Timothy Farrow ,  Walter Goodman ,  Dean Herring ,  William Martin-Otto ,  Rodrigo Samper ,  John Scavuzzo

IPC: A44B99/00 ,  H01L23/40 ,  H05K7/20

CPC classification number: H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44017 ,  Y10T24/44026 ,  H01L2924/00

Abstract: A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.

Abstract translation: 芯片夹层包括散热器，保持模块，安装在母板上的插座中的计算机芯片，波形垫圈弹簧和安装板。 散热器使用凸轮，钩和散热片安装在保持模块上，以提供散热器在计算机芯片上的初始定向。 为了在散热器和计算机芯片之间提供最终的接触压力，在计算机芯片下方和母板下方定向的波形垫圈弹簧提供抵抗母板底部，特别是抵靠计算机芯片中心的向上压力。 因此，通过波形垫圈弹簧推靠着计算机芯片的中心，在散热器和计算机芯片之间提供牢固的接触压力，同时最小化计算机芯片的引脚和芯片插座之间的压力量。

公开(公告)号：US20050141188A1

公开(公告)日：2005-06-30

申请号：US10746387

申请日：2003-12-24

Applicant: Joel Collins ,  Timothy Farrow ,  Brian Leonard

Inventor： Joel Collins ,  Timothy Farrow ,  Brian Leonard

IPC: G06F1/18 ,  G06F1/16

CPC classification number: G06F1/184 ,  G06F1/187

Abstract: A computer system having an opening configured to accept a device, the device assembly including at least one engagement surface. 3The computer system comprises a locking mechanism disposed in the opening to releasably latch the device assembly in the opening at a preselected position. The latching mechanism includes a hand actuated assembly movable in the opening for releasably engaging the engagement surface of the device assembly when the device assembly is located in the opening. The invention also contemplates the combination of the device assembly and the computer.

Abstract translation: 一种具有开口的计算机系统，该开口被配置为接纳设备，所述设备组件包括至少一个接合表面。 计算机系统包括设置在开口中的锁定机构，以将设备组件可释放地锁定在开口中的预选位置。 闭锁机构包括手动致动组件，其可在开口中移动，用于当装置组件位于开口中时可释放地接合装置组件的接合表面。 本发明还考虑了装置组件和计算机的组合。

公开(公告)号：US20050206058A1

公开(公告)日：2005-09-22

申请号：US11136914

申请日：2005-05-25

Applicant: Peter Masterson ,  Timothy Farrow

Inventor： Peter Masterson ,  Timothy Farrow

IPC: F16F1/373 ,  F16F15/08 ,  G11B33/08 ,  F16F5/00

CPC classification number: G11B33/08 ,  F16F1/3732 ,  F16F15/08

Abstract: An elastomeric pin isolator assembly is provided, including an elastomeric material, configured to engage a first support structure or mass, and a pin member, engaged with the elastomeric material, the pin member configured to slidably at least one of a second support structure or mass and the elastomeric material, and further wherein at least a portion of the elastomeric member is disposed between and second support structures or masses such that the first and second support structures or masses do not directly contact.

Abstract translation: 提供了一种弹性体销隔离器组件，其包括构造成接合第一支撑结构或物质的弹性体材料以及与弹性体材料接合的销构件，所述销构件被构造成可滑动地至少一个第二支撑结构或质量 和弹性体材料，并且其中弹性体构件的至少一部分设置在第二支撑结构或质量之间，使得第一和第二支撑结构或质量不直接接触。