发明申请
- 专利标题: CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
- 专利标题(中): 芯片包装及其制造方法
-
申请号: US11681219申请日: 2007-03-02
-
公开(公告)号: US20070205520A1公开(公告)日: 2007-09-06
- 发明人: Chien-Kang Chou , Chiu-Ming Chou , Li-Ren Lin , Hsin-Jung Lo
- 申请人: Chien-Kang Chou , Chiu-Ming Chou , Li-Ren Lin , Hsin-Jung Lo
- 申请人地址: TW Hsinchu 300
- 专利权人: MEGICA CORPORATION
- 当前专利权人: MEGICA CORPORATION
- 当前专利权人地址: TW Hsinchu 300
- 主分类号: H01L23/48
- IPC分类号: H01L23/48
摘要:
A chip package includes a semiconductor substrate, a first metal pad over the semiconductor substrate, and a second metal pad over the semiconductor substrate. In a case, the first metal pad is tape automated bonded thereto, and the second metal pad is solder bonded thereto. In another case, the first metal pad is tape automated bonded thereto, and the second metal pad is wirebonded thereto. In another case, the first metal pad is solder bonded thereto, and the second metal pad is wirebonded thereto. In another case, the first metal pad is bonded to an external circuitry using an anisotropic conductive film, and the second metal pad is solder bonded thereto. In another case, the first metal pad is bonded to an external circuitry using an anisotropic conductive film, and the second metal pad is wirebonded thereto.
公开/授权文献
- US08836146B2 Chip package and method for fabricating the same 公开/授权日:2014-09-16
信息查询
IPC分类: