发明申请
- 专利标题： COMPOSITE CIRCUIT BOARD
- 专利标题（中）： 复合电路板
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申请号： US11679698申请日： 2007-02-27
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公开(公告)号： US20070207637A1公开(公告)日： 2007-09-06
- 发明人: Satoshi Ito , Kazuhiro Maeno , Takamasa Nodo
- 申请人： Satoshi Ito , Kazuhiro Maeno , Takamasa Nodo
- 申请人地址： JP Kariya-shi
- 专利权人： Kabushiki Kaisha Toyota Jidoshokki
- 当前专利权人： Kabushiki Kaisha Toyota Jidoshokki
- 当前专利权人地址： JP Kariya-shi
- 优先权： JP2006-053230 20060228
- 主分类号： H01R12/00
- IPC分类号： H01R12/00
摘要：
A composite circuit board includes a first circuit board having a first land and a second circuit board having a second land at least a part of which is soldered to a part of the first land face-to-face. The first land has a region overlapped by the second circuit board. The region has a non-facing region which does not face to the second land.
信息查询
