公开(公告)号：US07705474B2

公开(公告)日：2010-04-27

申请号：US11670645

申请日：2007-02-02

申请人： Kunikazu Sato ,  Kazuhiro Maeno ,  Takamasa Nodo ,  Satoshi Ito

发明人： Kunikazu Sato ,  Kazuhiro Maeno ,  Takamasa Nodo ,  Satoshi Ito

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H05K3/363 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09172

摘要： A main substrate is provided with a wiring pattern on its surface and in the inner layer. A wiring pattern for connecting the signal line or power line of the main substrate to an external circuit is formed on the flexible printed circuit. A connection terminal to which a corresponding wiring pattern is connected is formed at the tip of the flexible printed circuit. A through-hole is formed between the wiring patterns. Potting resin is potted in each through-hole and around it. When the resin hardens, the potting resin joints the main substrate and the flexible printed circuit.

摘要翻译： 主基板在其表面和内层中设置有布线图案。 在柔性印刷电路上形成用于将主基板的信号线或电源线连接到外部电路的布线图案。 在柔性印刷电路的末端形成连接相应布线图案的连接端子。 在布线图案之间形成通孔。 灌封树脂浸在每个通孔和周围。 当树脂硬化时，灌封树脂接合主基板和柔性印刷电路。

公开(公告)号：US20070207637A1

公开(公告)日：2007-09-06

申请号：US11679698

申请日：2007-02-27

申请人： Satoshi Ito ,  Kazuhiro Maeno ,  Takamasa Nodo

发明人： Satoshi Ito ,  Kazuhiro Maeno ,  Takamasa Nodo

IPC分类号： H01R12/00

CPC分类号： H05K3/363 ,  H05K2201/09381 ,  H05K2201/09427

摘要： A composite circuit board includes a first circuit board having a first land and a second circuit board having a second land at least a part of which is soldered to a part of the first land face-to-face. The first land has a region overlapped by the second circuit board. The region has a non-facing region which does not face to the second land.

摘要翻译： 复合电路板包括具有第一焊盘的第一电路板和具有第二焊盘的第二电路板，第二焊盘的至少一部分被面对面地焊接到第一焊盘的一部分。 第一焊盘具有与第二电路板重叠的区域。 该地区有一个不面向第二个土地的不面对的地区。

公开(公告)号：US20070194428A1

公开(公告)日：2007-08-23

申请号：US11670645

申请日：2007-02-02

申请人： Kunikazu Sato ,  Kazuhiro Maeno ,  Takamasa Nodo ,  Satoshi Ito

发明人： Kunikazu Sato ,  Kazuhiro Maeno ,  Takamasa Nodo ,  Satoshi Ito

IPC分类号： H01L23/02

CPC分类号： H05K3/363 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09172

摘要： A main substrate is provided with a wiring pattern on its surface and in the inner layer. A wiring pattern for connecting the signal line or power line of the main substrate to an external circuit is formed on the flexible printed circuit. A connection terminal to which a corresponding wiring pattern is connected is formed at the tip of the flexible printed circuit. A through-hole is formed between the wiring patterns. Potting resin is potted in each through-hole and around it. When the resin hardens, the potting resin joints the main substrate and the flexible printed circuit.

摘要翻译： 主基板在其表面和内层中设置有布线图案。 在柔性印刷电路上形成用于将主基板的信号线或电源线连接到外部电路的布线图案。 在柔性印刷电路的末端形成连接相应布线图案的连接端子。 在布线图案之间形成通孔。 灌封树脂浸在每个通孔和周围。 当树脂硬化时，灌封树脂接合主基板和柔性印刷电路。

公开(公告)号：US08263875B2

公开(公告)日：2012-09-11

申请号：US11901078

申请日：2007-09-13

申请人： Takamasa Nodo ,  Haruo Takagi

发明人： Takamasa Nodo ,  Haruo Takagi

IPC分类号： H05K1/16

CPC分类号： H05K1/111 ,  H05K3/3442 ,  H05K2201/09254 ,  H05K2201/09281 ,  H05K2201/09381 ,  H05K2201/09727 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： A surface mounting structure for a surface mounting electronic component has an electronic component, a land, a wiring, and an electrical connection pattern. The electronic component has electrodes at opposite ends thereof. The land is connected to each electrode through a solder. The wiring is connected to the land and has a width which is smaller than a width of the electronic component in a width direction thereof. The wiring is connected to the electrical connection pattern. The electrical connection pattern has on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof.

摘要翻译： 用于表面安装电子部件的表面安装结构具有电子部件，焊盘，布线和电连接图案。 电子部件在其相对端具有电极。 焊盘通过焊料连接到每个电极。 布线连接到台面，其宽度小于电子部件的宽度方向的宽度。 接线连接到电气连接图案。 电连接图案具有在电连接图案的与电子部件的宽度方向的宽度大的宽度上连接的一侧。

公开(公告)号：US20080066955A1

公开(公告)日：2008-03-20

申请号：US11901078

申请日：2007-09-13

申请人： Takamasa Nodo ,  Haruo Takagi

发明人： Takamasa Nodo ,  Haruo Takagi

IPC分类号： H05K1/11

CPC分类号： H05K1/111 ,  H05K3/3442 ,  H05K2201/09254 ,  H05K2201/09281 ,  H05K2201/09381 ,  H05K2201/09727 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： A surface mounting structure for a surface mounting electronic component comprises an electronic component a land, a wiring, and an electrical connection pattern. The electronic component has electrodes at opposite ends thereof. The land is connected to each electrode through a solder. The wiring is connected to the land and has a width which is smaller than a width of the electronic component in a width direction thereof. The wiring is connected to the electrical connection pattern. The electrical connection pattern has on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof.

摘要翻译： 用于表面安装电子部件的表面安装结构包括电子部件，焊盘，布线和电连接图案。 电子部件在其相对端具有电极。 焊盘通过焊料连接到每个电极。 布线连接到台面，其宽度小于电子部件的宽度方向的宽度。 接线连接到电气连接图案。 电连接图案具有在电连接图案的与电子部件的宽度方向的宽度大的宽度上连接的一侧。

公开(公告)号：US20050121760A1

公开(公告)日：2005-06-09

申请号：US11004485

申请日：2004-12-03

申请人： Takamasa Nodo

发明人： Takamasa Nodo

IPC分类号： H05K1/18 ,  H01L23/48 ,  H01L29/78 ,  H05K1/02 ,  H05K3/34 ,  H01L29/00

CPC分类号： H05K1/0263 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/10166 ,  H05K2201/10272 ,  H05K2201/10522 ,  H01L2924/00

摘要： A semiconductor module has a semiconductor device, a wiring substrate, an external terminal, and a conductor. The semiconductor device includes a main electrode through which a main electric current flows. The wiring substrate includes a base plate and a main wiring pattern provided on a surface of the base plate. The main electrode of the semiconductor device is in electrical contact with the main wiring pattern. The external terminal is provided for electrically connecting an external of the wiring substrate with the main wiring pattern. The conductor extends longitudinally along a main electric current path, through which the main electric current of the semiconductor device flows, from the external terminal, or a portion adjacent to the external terminal, to the main electrode or a portion adjacent to the main electrode, while being in electrical contact with the main wiring pattern.

摘要翻译： 半导体模块具有半导体器件，布线基板，外部端子和导体。 半导体器件包括主电流流过的主电极。 布线基板包括基板和设置在基板的表面上的主布线图案。 半导体器件的主电极与主布线图形电接触。 外部端子用于将布线基板的外部与主布线图形电连接。 导体沿着主电流路径纵向延伸，半导体器件的主电流从外部端子或与外部端子相邻的部分流过主电极或与主电极相邻的部分， 同时与主布线图案电接触。