发明申请
- 专利标题： METHOD FOR FORMING EMBEDDED CAPACITORS ON A PRINTED CURCUIT BOARD AND RESULTANT PRINTED CIRCUIT BOARD
- 专利标题（中）： 在印刷电路板和印刷电路板上形成嵌入式电容器的方法
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申请号： US11276688申请日： 2006-03-10
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公开(公告)号： US20070209178A1公开(公告)日： 2007-09-13
- 发明人: Jovica Savic , Remy Chelini , Gregory Dunn
- 申请人： Jovica Savic , Remy Chelini , Gregory Dunn
- 申请人地址： US IL Schaumburg
- 专利权人： MOTOROLA, INC.
- 当前专利权人： MOTOROLA, INC.
- 当前专利权人地址： US IL Schaumburg
- 主分类号： H01G7/00
- IPC分类号： H01G7/00 ; H01K3/10
摘要：
A method for forming embedded capacitors on a printed circuit board is disclosed. The capacitor is formed on the printed circuit board by a depositing a first dielectric layer over one or more electrodes situated on the PCB. Another electrode is formed on top of the first dielectric layer and a second dielectric layer is deposited on top of that electrode. A third electrode is formed on top of the second dielectric layer. The two dielectric layers are abrasively delineated in a single step by a method such as sand blasting to define portions of the first and second dielectric layers to create a multilayer capacitive structure.
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