发明申请
- 专利标题: Flaky Copper Powder, Method For Producing The Same, And Conductive Paste
- 专利标题(中): 片状铜粉,生产方法和导电膏
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申请号: US11587976申请日: 2005-04-26
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公开(公告)号: US20070209475A1公开(公告)日: 2007-09-13
- 发明人: Takahiko Sakaue , Katsuhiko Yoshimaru , Yoshinobu Nakamura , Hiroyuki Shimamura
- 申请人: Takahiko Sakaue , Katsuhiko Yoshimaru , Yoshinobu Nakamura , Hiroyuki Shimamura
- 申请人地址: JP Tokyo 1418584
- 专利权人: Mitsui Mining & Smelting Co., Ltd.
- 当前专利权人: Mitsui Mining & Smelting Co., Ltd.
- 当前专利权人地址: JP Tokyo 1418584
- 优先权: JP2004-134689 20040428
- 国际申请: PCT/JP05/07877 WO 20050426
- 主分类号: B22F9/24
- IPC分类号: B22F9/24
摘要:
It is an object of the present invention to provide a flaky copper powder composed of fine particles having a sharp distribution particle size, a large crystallite diameter and high oxidation resistance. The flaky copper powder of the present invention contains P and has a crystallite diameter/D1A ratio of 0.01 or more to achieve the object. The method for producing the flaky copper powder comprises four steps: a first step of preparing an aqueous solution containing a copper salt and complexing agent; a second step of adding an alkali hydroxide to the aqueous solution to prepare a first slurry containing cupric oxide; a third step of adding a first reducing agent which can reduce the cupric oxide into cuprous oxide to the first slurry to prepare a second slurry containing cuprous oxide; and a fourth step of adding a second reducing agent which can reduce the cuprous oxide into copper to the second slurry to provide a flaky copper powder, wherein phosphoric acid and its salt are added in at least one of the first to third steps and/or in the second slurry in the fourth step.
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