公开(公告)号：US20140038818A1

公开(公告)日：2014-02-06

申请号：US14110295

申请日：2011-10-20

申请人： Yunosuke Nakahara ,  Takashi Wakabayashi ,  Yasunori Imada ,  Ohki Houshito ,  Yuki Nagao ,  Takahiko Sakaue ,  Akihiro Nara ,  Shinji Aoki

发明人： Yunosuke Nakahara ,  Takashi Wakabayashi ,  Yasunori Imada ,  Ohki Houshito ,  Yuki Nagao ,  Takahiko Sakaue ,  Akihiro Nara ,  Shinji Aoki

IPC分类号： B01J23/10

CPC分类号： B01J23/10 ,  B01D53/945 ,  B01D2255/2063 ,  B01D2255/2065 ,  B01D2255/407 ,  B01D2255/908 ,  B01D2255/9207 ,  B01J35/1014 ,  B01J37/0221 ,  B01J2523/00 ,  F01N2570/16 ,  Y02T10/22 ,  B01J2523/3706 ,  B01J2523/3712 ,  B01J2523/48

摘要： An internal combustion engine exhaust gas purifying catalyst carrier has a core body formed of a CeO2—ZrO2 solid solution or a CeO2—ZrO2—La2O2 solid solution, and CeO2 supported on the surface of the core body, wherein the core body has a CeO2 content of 5 to 35 mass % and an La2O2 content of 0 to 10 mass %, on the basis of the mass of the carrier, and the amount of CeO2 supported on the core body is 5 to 17 mass %, on the basis of the mass of the carrier.

摘要翻译： 内燃机废气净化催化剂载体具有由CeO 2 -ZrO 2固溶体或CeO 2 -ZrO 2 -La 2 O 2固溶体形成的芯体，以及负载在芯体表面的CeO 2，其中，芯体的CeO 2含量 基于载体的质量为5〜35质量％，La 2 O 2含量为0〜10质量％，并且，核心体上负载的CeO 2的量为5〜17质量％ 的承运人。

公开(公告)号：US20080090092A1

公开(公告)日：2008-04-17

申请号：US11658083

申请日：2005-07-15

申请人： Takahiko Sakaue ,  Keita Furumoto ,  Katsuhiko Yoshimaru

发明人： Takahiko Sakaue ,  Keita Furumoto ,  Katsuhiko Yoshimaru

IPC分类号： B22F1/02 ,  B05D3/10

CPC分类号： B22F1/025 ,  B22F2998/10 ,  C23C18/1635 ,  C23C18/1841 ,  C23C18/34 ,  H01B1/026 ,  H05K1/092 ,  Y10T428/12181 ,  B22F1/0088 ,  B22F1/0085

摘要： Objects of the present invention are to provide oxidation resistant nickel-coated copper powder for conductive paste capable of forming a conductive wiring part for an electronic circuit, and to provide a method for producing the same. In order to achieve the objects, there is provided nickel-coated copper powder which is characterized in that it comprises nickel-coated copper particles in which a core material is copper particles, a catalyst for plating is fixed to a surface of the copper-particles by reduction reaction and electroless plated nickel is applied to the outermost surface. The reduction reaction is characterized in that hydrazine is used as a reducing agent.

摘要翻译： 本发明的目的是提供一种能够形成用于电子电路的导电布线部分的用于导电浆料的耐氧化镍包覆铜粉末，并提供其制造方法。 为了实现上述目的，提供了镍包覆铜粉，其特征在于，其包含镍包覆的铜颗粒，其中芯材为铜颗粒，镀覆催化剂固定在铜颗粒表面 通过还原反应和无电镀镍施加到最外表面。 还原反应的特征在于将肼用作还原剂。

公开(公告)号：US20070209475A1

公开(公告)日：2007-09-13

申请号：US11587976

申请日：2005-04-26

申请人： Takahiko Sakaue ,  Katsuhiko Yoshimaru ,  Yoshinobu Nakamura ,  Hiroyuki Shimamura

发明人： Takahiko Sakaue ,  Katsuhiko Yoshimaru ,  Yoshinobu Nakamura ,  Hiroyuki Shimamura

IPC分类号： B22F9/24

CPC分类号： B22F1/0014 ,  B22F1/0044 ,  B22F1/0055 ,  B22F1/0062 ,  B22F9/24 ,  B22F2001/0033 ,  H01B1/22 ,  H05K1/095

摘要： It is an object of the present invention to provide a flaky copper powder composed of fine particles having a sharp distribution particle size, a large crystallite diameter and high oxidation resistance. The flaky copper powder of the present invention contains P and has a crystallite diameter/D1A ratio of 0.01 or more to achieve the object. The method for producing the flaky copper powder comprises four steps: a first step of preparing an aqueous solution containing a copper salt and complexing agent; a second step of adding an alkali hydroxide to the aqueous solution to prepare a first slurry containing cupric oxide; a third step of adding a first reducing agent which can reduce the cupric oxide into cuprous oxide to the first slurry to prepare a second slurry containing cuprous oxide; and a fourth step of adding a second reducing agent which can reduce the cuprous oxide into copper to the second slurry to provide a flaky copper powder, wherein phosphoric acid and its salt are added in at least one of the first to third steps and/or in the second slurry in the fourth step.

摘要翻译： 本发明的目的是提供一种由具有尖锐分布粒度，大晶粒直径和高抗氧化性的细颗粒组成的片状铜粉末。 本发明的片状铜粉含有P，并且具有0.01以上的微晶直径/ D 1A％比以达到目的。 片状铜粉的制造方法包括四个步骤：制备含有铜盐和络合剂的水溶液的第一步骤; 向该水溶液中添加碱性氢氧化物以制备含有氧化铜的第一浆料的第二步骤; 第三步骤，将第一还原剂加入到第一浆料中以制备含有氧化亚铜的第二浆料; 以及第四步骤，添加第二还原剂，其可以将氧化亚铜还原成铜到第二浆料中以提供片状铜粉末，其中在第一至第三步骤中的至少一个中加入磷酸及其盐，和/或 在第四步中的第二浆料中。

公开(公告)号：US20060137488A1

公开(公告)日：2006-06-29

申请号：US10536012

申请日：2003-08-11

申请人： Takahiko Sakaue ,  Kunihiko Yasunari ,  Katsuhiko Yoshimaru

发明人： Takahiko Sakaue ,  Kunihiko Yasunari ,  Katsuhiko Yoshimaru

IPC分类号： B22F1/00

CPC分类号： B22F1/0055 ,  B22F1/0007 ,  B22F1/0011 ,  B22F2998/00 ,  B22F2999/00 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/095 ,  B22F9/04 ,  H01L2924/00

摘要： The present invention is mainly for providing a flake copper powder for a conductive paste with particle properties which are defined by that the particle thickness is thinner being possible for use to form an electrode or a circuit, and a production process thereof. To achieve the object of producing the following particles, each powder particles shape is plastically processed into a flake-shape, wherein the flake copper powder has a cumulative particle diameter D50 of 10 μm or smaller measured with laser diffraction scattering particle size distribution method. The D10, D50 and D90 measured with the laser diffraction scattering particle size distribution method are illustrative and the SD/D50 value measured by the standard deviation of particle distribution with the laser diffraction scattering particle size distribution, is 0.55 or larger and/or a D90/D10 of 4.5 or smaller. The flake copper powder is compressed with a high energy ball mill whose media beads having fine particle diameter which plastically deforms the copper particles into flake-shaped particles, so that stable flake copper powder is produced.

摘要翻译： 本发明主要用于提供具有颗粒性质的导电糊状的薄片状铜粉末，其特征在于可以用于形成电极或电路的颗粒厚度较薄，及其制造方法。 为了实现生产下列颗粒的目的，将每种粉末颗粒形状塑性加工成片状，其中片状铜粉末的累积粒径D <50> 10微米或更小，用激光测量 衍射散射粒度分布法。 使用激光衍射散射粒度分布法测量的D 10 N，D 50和D 90 90是说明性的，SD / D < 通过具有激光衍射散射粒度分布的粒子分布的标准偏差测量的值为0.55或更大，和/或D <90 / D> 10 < 4.5或更小。 用高能球磨机对片状铜粉进行压缩，其中具有细粒径的介质珠使铜颗粒塑性变形为片状颗粒，从而产生稳定的片状铜粉末。

公开(公告)号：US20080004358A1

公开(公告)日：2008-01-03

申请号：US11722452

申请日：2005-12-16

申请人： Akira Aoki ,  Yoshinobu Nakamura ,  Takahiko Sakaue ,  Katsuhiko Yoshimaru

发明人： Akira Aoki ,  Yoshinobu Nakamura ,  Takahiko Sakaue ,  Katsuhiko Yoshimaru

IPC分类号： B01F3/12 ,  C22C9/00

CPC分类号： B22F1/0022 ,  B22F9/24 ,  B22F2998/00 ,  B82Y30/00 ,  H05K1/092 ,  B22F1/0044

摘要： It is an object to provide a superfine copper powder slurry which enables finer-pitch wirings formation on the substrates when it is used for an electroconductive ink or an electroconductive paste for wirings. In order to achieve the object, a superfine copper powder slurry produced by suspending a superfine copper powder having powder characteristics of the value DTEM (micron meter) of 0.01 to 0.1, the ratio D50/DTEM of 1.0 to 1.5 and the ratio grain size/DTEM of 0.2 to 1 in a solvent, where (DTEM is) an average primary particle diameter of the powder particle diameter directly measured from observation image of TEM and calculated with observation magnification, and D50 is a particle diameter at 50% cumulative particle size examined by Doppler scattering photo analysis.

摘要翻译： 本发明的目的是提供一种超细铜粉浆料，其用于导电油墨或导电糊料用于配线时，能够在基材上形成更细的节距布线。 为了达到上述目的，通过将具有粉末特性为D TEM（微米）的超细铜粉末悬浮在0.01〜0.1的比例D 50下制造的超细铜粉末浆料 在溶剂中为1.0〜1.5，晶粒尺寸/ D TEM TEM比率为0.2〜1，其中（D TEM）是）从TEM的观察图像直接测量的粉末粒径的平均一次粒径，并用观测倍率计算，D 50是通过多普勒检查的50％累积粒径的粒径 散射照片分析。

公开(公告)号：US20050183543A1

公开(公告)日：2005-08-25

申请号：US11037329

申请日：2005-01-19

申请人： Takuya Sasaki ,  Masashi Kato ,  Taku Fujimoto ,  Takahiko Sakaue ,  Katsuhiko Yoshimaru

发明人： Takuya Sasaki ,  Masashi Kato ,  Taku Fujimoto ,  Takahiko Sakaue ,  Katsuhiko Yoshimaru

IPC分类号： B22F1/00 ,  B22F1/02 ,  B22F9/24 ,  C22B3/44 ,  C22B11/00 ,  H01L23/498 ,  H05K1/09

CPC分类号： H01L23/49883 ,  B22F1/0014 ,  B22F1/0096 ,  B22F9/24 ,  B22F2999/00 ,  C22B3/44 ,  C22B11/04 ,  H01L2924/0002 ,  H05K1/095 ,  H05K2201/0218 ,  Y02P10/234 ,  B22F9/20 ,  B22F2202/11 ,  H01L2924/00

摘要： This invention is a silver powder having a low-temperature sintering performance and dispersibility, which allows the powder particles to be agglomerated to a small degree and be nearly in the monodisperse state. Employed is silver powder of fine silver particles each to which fine silver particles adhere, wherein fine silver particles of nano-order particle size are adhered to the surface of each silver powder particle. The powder particles of the silver powder of fine silver particles each to which fine silver particles adhere have excellent dispersibility. In the production of the silver powder of fine silver particles each to which fine silver particles adhere, a process of including the steps of: adding a silver nitrate and a neutralizing agent into a slurry of silver powder in a dispersing medium; dissolving the mixture while stirring to allow fine silver oxide particles to be precipitated on the surface of each silver powder particle; washing the resultant silver powder; and exposing the fine silver oxide particles to UV rays to reduce the same to fine silver particles.

摘要翻译： 本发明是具有低温烧结性能和分散性的银粉，其允许粉末颗粒少量结块并且几乎处于单分散状态。 使用细银银颗粒的银粉末，其中细粒银颗粒粘附，其中纳米级粒度的细银颗粒粘附到每个银粉颗粒的表面。 银粒子附着的细银粒子的银粉末的粉末颗粒具有优异的分散性。 在生产细银粒子附着的细银粒子的银粉的制造中，包括以下步骤的方法：在分散介质中的银粉浆料中加入硝酸银和中和剂; 在搅拌的同时溶解混合物，使得银粉末颗粒的表面上沉淀出细小的氧化银颗粒; 洗涤所得银粉; 并将细小的氧化银颗粒暴露于紫外线以将其还原成细微的银颗粒。

公开(公告)号：US20070212564A1

公开(公告)日：2007-09-13

申请号：US11578536

申请日：2005-04-11

申请人： Takuya Sasaki ,  Takahiko Sakaue ,  Taku Fujimoto ,  Katsuhiko Yoshimaru

发明人： Takuya Sasaki ,  Takahiko Sakaue ,  Taku Fujimoto ,  Katsuhiko Yoshimaru

IPC分类号： B22F1/02 ,  H01B5/00

CPC分类号： B22F1/02 ,  C23C24/10 ,  C23C26/02 ,  H01B1/02 ,  H01B1/22 ,  H05K1/095 ,  H05K3/4069 ,  Y10T428/12181

摘要： The objects of the present invention are to provide silver compound-coated silver powder applicable to a conductive paste for forming conductive interconnections for an electronic circuit by the silver powder coated with a silver compound which is thermally decomposed at lower temperature than a melting point of silver, and also to provide a method for producing the same. The means for achieving the objects involves thermal decomposition of the silver compound which is decomposed at much lower temperature than a melting point of silver to fuse silver compound-coated silver particles to each other by silver from the silver compound during sintering of a substrate on which electronic circuit conductive interconnections are to be formed by the conductive paste which contains the silver compound-coated silver powder containing the silver compound-coated silver particles in which the silver particles are coated with the silver compound.

摘要翻译： 本发明的目的是提供一种适用于用于形成电子电路用导电互连用导电性糊剂的银化合物涂覆银粉，该银粉末涂覆有银化合物，该银化合物在低于银熔点的温度下被热分解 并且还提供其制造方法。 用于实现目的的手段涉及银化合物的热分解，该银化合物在比银熔点低得多的温度下被分解，以使银化合物涂覆的银颗粒在银的烧结过程中由银化合物彼此熔化， 电子电路导体互连将由包含银化合物涂覆的银粉的导电膏形成，该银粉含银银化合物包覆的银颗粒，银颗粒用银化合物涂覆。

公开(公告)号：US09669389B2

公开(公告)日：2017-06-06

申请号：US14110295

申请日：2011-10-20

申请人： Yunosuke Nakahara ,  Takashi Wakabayashi ,  Yasunori Imada ,  Ohki Houshito ,  Yuki Nagao ,  Takahiko Sakaue ,  Akihiro Nara ,  Shinji Aoki

发明人： Yunosuke Nakahara ,  Takashi Wakabayashi ,  Yasunori Imada ,  Ohki Houshito ,  Yuki Nagao ,  Takahiko Sakaue ,  Akihiro Nara ,  Shinji Aoki

IPC分类号： B01J23/10 ,  B01J37/02 ,  B01D53/94 ,  B01J35/10

CPC分类号： B01J23/10 ,  B01D53/945 ,  B01D2255/2063 ,  B01D2255/2065 ,  B01D2255/407 ,  B01D2255/908 ,  B01D2255/9207 ,  B01J35/1014 ,  B01J37/0221 ,  B01J2523/00 ,  F01N2570/16 ,  Y02T10/22 ,  B01J2523/3706 ,  B01J2523/3712 ,  B01J2523/48

摘要： An internal combustion engine exhaust gas purifying catalyst carrier has a core body formed of a CeO2—ZrO2 solid solution or a CeO2—ZrO2—La2O2 solid solution, and CeO2 supported on the surface of the core body, wherein the core body has a CeO2 content of 5 to 35 mass % and an La2O2 content of 0 to 10 mass %, on the basis of the mass of the carrier, and the amount of CeO2 supported on the core body is 5 to 17 mass %, on the basis of the mass of the carrier.

公开(公告)号：US20090032139A1

公开(公告)日：2009-02-05

申请号：US11912940

申请日：2006-04-27

申请人： Takahiko Sakaue ,  Keita Furumoto ,  Katsuhiko Yoshimaru

发明人： Takahiko Sakaue ,  Keita Furumoto ,  Katsuhiko Yoshimaru

IPC分类号： B23K35/22 ,  H01B1/02

CPC分类号： H05K1/097 ,  B22F1/0048 ,  B22F1/0055 ,  B22F9/24 ,  H05K3/4069

摘要： Object of the invention is to provide a tin powder containing fine tin particles which performs fine pitch wiring circuit easily, excellent in filling the minute diameter via holes, and exhibits low temperature fusibility. In order to achieve the object, a copper powder slurry is prepared by adding a copper powder in water with agitation and a tin solution for deposition by substitution is prepared by adding an acid to an aqueous mixture solution containing a stannous salt and thiourea. Then the copper powder slurry and the tin solution for deposition by substitution are mixed with agitation in a certain ratio of tin in the solution against to copper in the slurry to deposit tin by substitution on the surface of the copper powder. As a result, the tin powder of the present invention is obtained.

摘要翻译： 本发明的目的是提供一种含有细锡颗粒的锡粉，其容易地进行细间距布线电路，在通孔中填充微小直径优异，并且显示低温熔融性。 为了达到上述目的，通过在水中搅拌加入铜粉而制备铜粉浆料，通过在含有亚锡盐和硫脲的混合水溶液中加入酸来制备用于沉积的锡溶液。 然后将铜粉和用于通过置换沉积的锡溶液以一定比例的锡溶液与浆料中的铜混合搅拌混合，以通过在铜粉表面上的取代沉积锡。 结果，得到本发明的锡粉末。

公开(公告)号：US20080042111A1

公开(公告)日：2008-02-21

申请号：US11629888

申请日：2005-06-17

申请人： Takahiko Sakaue ,  Keita Furumoto ,  Katsuhiko Yoshimaru

发明人： Takahiko Sakaue ,  Keita Furumoto ,  Katsuhiko Yoshimaru

IPC分类号： H01B1/02 ,  B22F1/00 ,  C22C13/00

CPC分类号： H01B1/22 ,  B22F1/025 ,  B22F9/16 ,  B22F2998/00 ,  B23K35/025 ,  B23K35/26 ,  B23K35/302 ,  B23K35/40 ,  C22B3/46 ,  C22B15/0091 ,  C22B25/04 ,  C23C18/1635 ,  C23C18/31 ,  C23C18/54 ,  H05K1/095 ,  H05K3/4069 ,  Y02P10/234 ,  Y02P10/236 ,  B22F1/0055

摘要： It is an object to provide a copper-containing tin powder having excellent capabilities in forming fine wiring circuits and filling via holes with ability in bond by melting at a low temperature. In order to achieve the object, it is produced from a copper powder as a starting material by a wet substitution process and it contains remainder of copper un-substituted at 30% by weight or less. The change rate of properties of the copper-containing tin powder, e.g. an average primary particle size or the like is in the range from −20 to +5% with respect to the starting copper powders. The copper-containing tin powder is produced by a wet substitution process in which a copper powder is brought into contact with a plating solution for tin substitution to make copper component constituting the copper powder dissolve with simultaneous substituted deposition of tin.

摘要翻译： 本发明的目的是提供一种具有优异的形成精细布线电路的能力的铜含量的锡粉末，并且通过在低温下的熔融来填充通孔的能力。 为了达到上述目的，通过湿式取代法由铜粉作为原料制造，含有30重量％以下的未取代的铜的剩余部分。 含铜锡粉的性能变化率，例如 相对于起始铜粉，平均一次粒径等在-20〜+ 5％的范围内。 含铜锡粉末通过湿式取代工艺制造，其中使铜粉与用于锡取代的镀液接触，以使铜构成的铜成分同时代替沉积锡而溶解。