Invention Application
US20070210450A1 Method of forming a bump and a connector structure having the bump
审中-公开
形成凸块的方法和具有凸块的连接器结构
- Patent Title: Method of forming a bump and a connector structure having the bump
- Patent Title (中): 形成凸块的方法和具有凸块的连接器结构
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Application No.: US11708496Application Date: 2007-02-21
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Publication No.: US20070210450A1Publication Date: 2007-09-13
- Inventor: Woo-Jin Jang , Kwang-Myeon Park
- Applicant: Woo-Jin Jang , Kwang-Myeon Park
- Priority: KR10-2006-22924 20060313
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
A bump may be formed by forming a diffusion barrier layer pattern over a substrate having a conductive pad; forming a seed layer over the substrate having the diffusion barrier layer pattern and the conductive pad; forming a conductive bump over the seed layer; and patterning the seed layer using the conductive bump as an etching mask.
Information query
IPC分类:
