发明申请
- 专利标题： COMPOSITE BUMP
- 专利标题（中）： 复合BUMP
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申请号： US11308180申请日： 2006-03-10
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公开(公告)号： US20070210457A1公开(公告)日： 2007-09-13
- 发明人: Ji-Cheng Lin , Yao-Sheng Lin , Shyh-Ming Chang , Su-Tsai Lu , Hsien-Chie Cheng , Tai-Hong Chen
- 申请人： Ji-Cheng Lin , Yao-Sheng Lin , Shyh-Ming Chang , Su-Tsai Lu , Hsien-Chie Cheng , Tai-Hong Chen
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52
摘要：
A composite bump suitable for disposing on a substrate pad is provided. The composite bump includes a compliant body and an outer conductive layer. The coefficient of thermal expansion (CTE) of the compliant body is between 5 ppm/° C. and 200 ppm/° C. The outer conductive layer covers the compliant body and is electrically connected to the pad. The compliant body can provide a stress buffering effect for a bonding operation. Furthermore, by setting of the CTE of the compliant body within a preferable range, damages caused by thermal stress are reduced while the bonding effect is enhanced.
公开/授权文献
- US07378746B2 Composite bump 公开/授权日：2008-05-27
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