- 专利标题： Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
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申请号： US11797713申请日： 2007-05-07
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公开(公告)号： US20070212980A1公开(公告)日： 2007-09-13
- 发明人: Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
- 申请人： Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
- 优先权： KR2003-38740 20030616
- 主分类号： B24B49/00
- IPC分类号： B24B49/00 ; B24B7/30 ; B24B29/00 ; B24D11/00
摘要：
A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.
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