发明申请
US20070220824A1 Board Building Material, Board Building Material Producing Method, Board Building Material Installation Method
有权
板材建筑材料，板材建筑材料生产方法，板材建筑材料安装方法
- 专利标题： Board Building Material, Board Building Material Producing Method, Board Building Material Installation Method
- 专利标题（中）： 板材建筑材料，板材建筑材料生产方法，板材建筑材料安装方法
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申请号： US11587999申请日： 2005-04-27
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公开(公告)号： US20070220824A1公开(公告)日： 2007-09-27
- 发明人: Tomoya Hasegawa , Yasuyuki Amagai , Shoichi Okazaki , Masahiro Wada
- 申请人： Tomoya Hasegawa , Yasuyuki Amagai , Shoichi Okazaki , Masahiro Wada
- 优先权： JP2004-132587 20040428; JP2004-366580 20041217
- 国际申请： PCT/JP05/08463 WO 20050427
- 主分类号： E04F13/072
- IPC分类号： E04F13/072 ; E04B1/86 ; E04B9/04
摘要：
Perforations of a board for building material are formed by a number of recesses (13), or a number of recesses (13) and through-holes (12). A bottom face (16) of the recess forms a face for screwing or driving the fixing element (70) thereto. A color of the bottom face is set to have a brightness of color decreased in comparison with a color of a surface (18) of the board. A substrate of the board is a gypsum board and the bottom face of the recess is formed by a liner paper for gypsum board. According to such a board, a region for screwing or driving the fixing element thereto can be ensured without impairing regularity, uniformity or architectural design of the perforations, and putty finishing or the like for an exposed part of the fixing element can be omitted.
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