发明申请
- 专利标题: PLANARIZATION APPARATUS
- 专利标题(中): 平面设备
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申请号: US11680237申请日: 2007-02-28
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公开(公告)号: US20070224918A1公开(公告)日: 2007-09-27
- 发明人: Shouichi Terada , Tsuyoshi Mizuno , Takeshi Uehara
- 申请人: Shouichi Terada , Tsuyoshi Mizuno , Takeshi Uehara
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 优先权: JP2006-065960 20060310
- 主分类号: B24B49/00
- IPC分类号: B24B49/00
摘要:
The present invention is a planarization apparatus for planarizing a coating film applied on a substrate before the coating film is hardened, including a contact body such as a brush or sponge brought into contact with a front surface of the coating film on the substrate; and a contact body drive mechanism for pressing the contact body against the front surface of the coating film and moving the contact body along the front surface of the coating film. The contact body is pressed against the coating film before it is hardened, and moved along the front surface of the coating film, whereby the coating film can be planarized to a predetermined film thickness. According to the present invention, the coating film can be planarized without using the CMP apparatus.
公开/授权文献
- US07416474B2 Planarization apparatus 公开/授权日:2008-08-26