发明申请
- 专利标题： Arrangement of semiconductor memory devices and semiconductor memory module comprising an arrangement of semiconductor memory devices
- 专利标题（中）： 包括半导体存储器件的布置的半导体存储器件和半导体存储器模块的布置
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申请号： US11638310申请日： 2006-12-12
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公开(公告)号： US20070228436A1公开(公告)日： 2007-10-04
- 发明人: Hermann Ruckerbauer , Holger Schroeter
- 申请人： Hermann Ruckerbauer , Holger Schroeter
- 优先权： DE102005059189.2 20051212
- 主分类号： H01L29/94
- IPC分类号： H01L29/94
摘要：
An arrangement of semiconductor memory devices includes a first semiconductor memory device and a second semiconductor memory device. The arrangement of semiconductor memory devices also has a flexible substrate. A first electrically conductive conductor track is arranged in the flexible substrate. At least one first contact of the flexible substrate is coupled to the at least one second contact of the second semiconductor memory device through the first electrically conductive conductor track. A second electrically conductive conductor track is arranged in the flexible substrate.
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