发明申请
- 专利标题： CONDUCTIVE BASE MATERIAL WITH THIN FILM RESISTANCE LAYER, METHOD OF PRODUCTION OF CONDUCTIVE BASE MATERIAL WITH THIN FILM RESISTANCE LAYER, AND CIRCUIT BOARD WITH THIN FILM RESISTANCE LAYER
- 专利标题（中）： 具有薄膜电阻层的导电基材，具有薄膜电阻层的导电基材的生产方法和具有薄膜电阻层的电路板
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申请号： US11693273申请日： 2007-03-29
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公开(公告)号： US20070228443A1公开(公告)日： 2007-10-04
- 发明人: Yuuki KIKUCHI , Yuuji Suzuki , Sadao Matsumoto , Satoru Zama , Yoshiaki Ogiwara
- 申请人： Yuuki KIKUCHI , Yuuji Suzuki , Sadao Matsumoto , Satoru Zama , Yoshiaki Ogiwara
- 申请人地址： JP Nikko-city JP Tokyo
- 专利权人： Furukawa Circuit Foil Co., Ltd,THE FURUKAWA ELECTRIC CO., LTD.
- 当前专利权人： Furukawa Circuit Foil Co., Ltd,THE FURUKAWA ELECTRIC CO., LTD.
- 当前专利权人地址： JP Nikko-city JP Tokyo
- 优先权： JP2006-091356 20060329
- 主分类号： H05K1/03
- IPC分类号： H05K1/03
摘要：
An inexpensive conductive base material with a thin film resistance layer having small variation of the sheet resistance value and a conductive base material with a resistance layer enabling production of a printed resistor circuit board by stably leaving behind resistance elements, that is, a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer includes Ni containing P and an amorphous and a crystalloid form are mixed together and a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer is a crystalline thin film resistance layer including Ni containing P.
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