公开(公告)号：US20070228443A1

公开(公告)日：2007-10-04

申请号：US11693273

申请日：2007-03-29

申请人： Yuuki KIKUCHI ,  Yuuji Suzuki ,  Sadao Matsumoto ,  Satoru Zama ,  Yoshiaki Ogiwara

发明人： Yuuki KIKUCHI ,  Yuuji Suzuki ,  Sadao Matsumoto ,  Satoru Zama ,  Yoshiaki Ogiwara

IPC分类号： H05K1/03

CPC分类号： H05K1/167 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723 ,  H05K2203/1105 ,  Y10T29/49082

摘要： An inexpensive conductive base material with a thin film resistance layer having small variation of the sheet resistance value and a conductive base material with a resistance layer enabling production of a printed resistor circuit board by stably leaving behind resistance elements, that is, a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer includes Ni containing P and an amorphous and a crystalloid form are mixed together and a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer is a crystalline thin film resistance layer including Ni containing P.

摘要翻译： 具有薄膜电阻层的廉价的导电基材，具有薄的电阻值变化小的导电性基材和具有通过稳定地留下电阻元件而制造印刷电阻电路板的电阻层的导电性基材，即导电性基材 具有薄膜电阻层，其由在其表面上形成有电阻层的导电性基材构成，其中电阻层包括含有P的Ni和非晶态和晶体形式混合在一起，并且具有薄膜电阻层的导电基材包含 具有在其表面上形成的电阻层的导电基材，其中电阻层是包含含Ni的结晶薄膜电阻层。

公开(公告)号：US20070048507A1

公开(公告)日：2007-03-01

申请号：US11496624

申请日：2006-08-01

申请人： Yuuji SUZUKI ,  Yuuki KIKUCHI ,  Satoru ZAMA

发明人： Yuuji SUZUKI ,  Yuuki KIKUCHI ,  Satoru ZAMA

IPC分类号： B32B3/00 ,  B32B18/00

CPC分类号： H05K3/4069 ,  B32B15/08 ,  B32B15/098 ,  B32B15/20 ,  B32B2307/202 ,  B32B2307/538 ,  B32B2307/5825 ,  B32B2307/704 ,  B32B2457/00 ,  C25D5/16 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0425 ,  H05K2203/1461 ,  Y10T428/24917 ,  Y10T428/24926

摘要： To provide a laminated circuit board, in which a conductive paste including low melting point metal is used, without generating a void and crack at a boundary portion between a copper foil and the conductive paste containing low melting point metal, and having high reliability for connection. The laminated circuit board is formed by forming a roughening treated layer by projections having surface roughnesses of 0.3 to 10 μm and the average amount of deposition of 150 mg/dm2 or less on an original foil including a copper foil or copper alloy foil having surface roughness of 0.1 to 5 μm at least on one side to form a surface treated copper foil, providing the conductive paste containing low melting point metal on a roughening treated layer side of surface treated copper foil, and laminating the surface treated copper foil with a resin board.

摘要翻译： 为了提供使用包含低熔点金属的导电糊料的层叠电路板，在铜箔和含有低熔点金属的导电糊料之间的边界部分不产生空隙和裂纹，并且具有高的连接可靠性 。 叠层电路板通过在包括铜的原始箔上形成表面粗糙度为0.3-10μm的凸起和平均沉积量为150mg / dm 2以下的凸起来形成粗糙化处理层 至少在一面上具有0.1〜5μm的表面粗糙度的箔或铜合金箔，以形成表面处理铜箔，在表面处理铜箔的粗糙化处理层侧上提供含有低熔点金属的导电膏， 表面处理铜箔与树脂板。