- 专利标题: SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF
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申请号: US11399827申请日: 2006-04-07
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公开(公告)号: US20070235770A1公开(公告)日: 2007-10-11
- 发明人: Shyh-Fann Ting , Cheng-Tung Huang , Wen-Han Hung , Li-Shian Jeng , Kun-Hsien Lee , Tzyy-Ming Cheng , Jing-Chang Wu , Tzermin Shen
- 申请人: Shyh-Fann Ting , Cheng-Tung Huang , Wen-Han Hung , Li-Shian Jeng , Kun-Hsien Lee , Tzyy-Ming Cheng , Jing-Chang Wu , Tzermin Shen
- 主分类号: H01L29/76
- IPC分类号: H01L29/76
摘要:
A semiconductor structure is disclosed, including a substrate having therein a first well of a first conductivity type and a second well of a second conductivity type, a first MOS transistor of the first conductivity type and a second MOS transistor of the second conductivity type. The first MOS transistor is disposed on the second well, including a gate structure on the second well and a strained layer of the first conductivity type in an opening in the second well beside the gate structure. The difference between the cell parameter of a portion of the strained layer near the bottom of the opening and that of the substrate is less than the difference between the cell parameter of a portion of the strained layer apart from the bottom of the opening and that of the substrate. The second MOS transistor is disposed on the first well.
公开/授权文献
- US07288822B1 Semiconductor structure and fabricating method thereof 公开/授权日:2007-10-30
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