发明申请
- 专利标题: METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE
- 专利标题(中): 用于抛光衬底边缘的方法和装置
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申请号: US11693695申请日: 2007-03-29
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公开(公告)号: US20070238393A1公开(公告)日: 2007-10-11
- 发明人: Ho Shin , Gary Ettinger , Donald Olgado , Erik Wasinger , Sen-Hou Ko , Charles Dodds , Yufei Chen , Wei-Yung Hsu
- 申请人: Ho Shin , Gary Ettinger , Donald Olgado , Erik Wasinger , Sen-Hou Ko , Charles Dodds , Yufei Chen , Wei-Yung Hsu
- 主分类号: B24B51/00
- IPC分类号: B24B51/00 ; B24B49/00 ; B24B7/30
摘要:
Methods of and systems for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of one of energy and torque exerted in rotating the substrate against the polishing film. The invention may further include determining an amount of material removed from the edge of the substrate based on the detected energy or torque exerted in rotating the substrate against the polishing film; ascertaining a difference between the determined amount of material removed and a preset polish level; and determining an amount of energy or torque to be exerted in rotating the substrate adapted to attain the preset polish level based on the difference between the determined amount of material removed and the preset polish level. Numerous other aspects are provided.