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    METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE
    1.
    发明申请
    METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE 审中-公开
    用于抛光衬底边缘的方法和装置

    公开(公告)号：US20070238393A1

    公开(公告)日：2007-10-11

    申请号：US11693695

    申请日：2007-03-29

    申请人： Ho Shin ,  Gary Ettinger ,  Donald Olgado ,  Erik Wasinger ,  Sen-Hou Ko ,  Charles Dodds ,  Yufei Chen ,  Wei-Yung Hsu

    发明人： Ho Shin ,  Gary Ettinger ,  Donald Olgado ,  Erik Wasinger ,  Sen-Hou Ko ,  Charles Dodds ,  Yufei Chen ,  Wei-Yung Hsu

    IPC分类号： B24B51/00 ,  B24B49/00 ,  B24B7/30

    CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B41/067 ,  B24B49/16 ,  B24B57/02

    摘要： Methods of and systems for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of one of energy and torque exerted in rotating the substrate against the polishing film. The invention may further include determining an amount of material removed from the edge of the substrate based on the detected energy or torque exerted in rotating the substrate against the polishing film; ascertaining a difference between the determined amount of material removed and a preset polish level; and determining an amount of energy or torque to be exerted in rotating the substrate adapted to attain the preset polish level based on the difference between the determined amount of material removed and the preset polish level. Numerous other aspects are provided.

    摘要翻译： 提供了抛光衬底边缘的方法和系统。 本发明包括将衬底旋转抵靠抛光膜，以便从衬底的边缘去除材料; 并且检测在将衬底旋转抛光膜时施加的能量和扭矩中的一个的量。 本发明还可以包括基于在将衬底旋转抛光膜时所检测到的能量或扭矩确定从衬底边缘去除的材料量; 确定确定的去除材料量与预设抛光水平之间的差异; 以及基于所确定的所移除的材料量与所述预设的抛光水平之间的差来确定在旋转所述基板时施加的能量或扭矩的量，所述能量或扭矩适于实现预设的抛光水平。 提供了许多其他方面。

    Methods and apparatus for processing a substrate
    2.
    发明申请
    Methods and apparatus for processing a substrate 有权
    用于处理衬底的方法和设备

    公开(公告)号：US20070131654A1

    公开(公告)日：2007-06-14

    申请号：US11299295

    申请日：2005-12-09

    申请人： Erik Wasinger ,  Gary Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Shin ,  Donald Olgado

    发明人： Erik Wasinger ,  Gary Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Shin ,  Donald Olgado

    IPC分类号： C03C15/00 ,  H01L21/306

    CPC分类号： C03C19/00 ,  B24B1/04 ,  B24B9/065 ,  B24B21/004 ,  H01L21/02021

    摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.

    摘要翻译： 适于抛光衬底边缘的装置和方法包括抛光膜，适于张紧和加载抛光膜的框架，使得膜的至少一部分被支撑在平面中，以及基板旋转驱动器，其适于旋转 衬底抵靠抛光膜的平面，使得抛光膜适于对衬底施加力，轮廓到衬底的边缘，边缘至少包括外边缘和第一斜面，并且抛光外边缘和 第一斜面作为基底旋转。 提供了许多其他方面。

    METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
    6.
    发明申请
    METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE 审中-公开
    用于处理基板的方法和装置

    公开(公告)号：US20090017731A1

    公开(公告)日：2009-01-15

    申请号：US12239730

    申请日：2008-09-26

    申请人： Gary C. Ettinger ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

    发明人： Gary C. Ettinger ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

    IPC分类号： B24B1/00

    CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B41/002 ,  H01L21/02021

    摘要： Methods and apparatus for cleaning an edge of a substrate are provided. The invention includes a polishing film having a polishing side and a second side; an inflatable pad disposed adjacent the second side of the polishing film; a frame adapted to support the polishing film and the inflatable pad; and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film, wherein the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate with the polishing film contacting the edge of the substrate. Numerous other aspects are provided.

    摘要翻译： 提供了用于清洁基板边缘的方法和设备。 本发明包括具有抛光侧和第二面的抛光膜; 邻近抛光膜的第二侧设置的可充气垫; 适于支撑抛光膜和可充气垫的框架; 以及衬底旋转驱动器，其适于将衬底旋转抵靠所述抛光膜的抛光侧，其中所述抛光膜设置在所述衬底的边缘和所述可充气垫之间，使得所述可充气衬垫和抛光膜轮廓到所述衬底的边缘 抛光膜与基板的边缘接触。 提供了许多其他方面。

    Methods and apparatus for cleaning an edge of a substrate
    7.
    发明申请
    Methods and apparatus for cleaning an edge of a substrate 审中-公开
    用于清洁衬底边缘的方法和设备

    公开(公告)号：US20060243304A1

    公开(公告)日：2006-11-02

    申请号：US11411012

    申请日：2006-04-24

    申请人： Wei-Yung Hsu ,  Donald Olgado ,  Ho Shin ,  Liang-Yuh Chen

    发明人： Wei-Yung Hsu ,  Donald Olgado ,  Ho Shin ,  Liang-Yuh Chen

    IPC分类号： B08B7/00 ,  B08B5/04

    CPC分类号： H01L21/67046 ,  B08B1/04 ,  H01L21/67028

    摘要： In one aspect, a method for cleaning an edge of a substrate is provided. The method includes the steps of (a) supporting a substrate on a rotatable substrate support; (b) contacting an edge of the substrate with one or more rollers; (c) rotating the substrate support so as to rotate the substrate; and (d) rotating the one or more rollers so as to clean the edge of the substrate Numerous other aspects are provided.

    摘要翻译： 一方面，提供一种清洗基板的边缘的方法。 该方法包括以下步骤：（a）将基板支撑在可旋转的基板支撑件上; （b）使所述基板的边缘与一个或多个辊接触; （c）旋转衬底支撑件以旋转衬底; 和（d）旋转所述一个或多个辊以便清洁所述基底的边缘。提供许多其它方面。

    METHODS AND APPARATUS FOR SUPPORTING A SUBSTRATE IN A HORIZONTAL ORIENTATION DURING CLEANING
    10.
    发明申请
    METHODS AND APPARATUS FOR SUPPORTING A SUBSTRATE IN A HORIZONTAL ORIENTATION DURING CLEANING 审中-公开
    在清洗期间支撑水平方向底板的方法和装置

    公开(公告)号：US20080011325A1

    公开(公告)日：2008-01-17

    申请号：US11757850

    申请日：2007-06-04

    申请人： Donald Olgado ,  Roy Nangoy ,  Shesraj Tulshibagwale ,  Hui Chen ,  Ho Shin

    发明人： Donald Olgado ,  Roy Nangoy ,  Shesraj Tulshibagwale ,  Hui Chen ,  Ho Shin

    IPC分类号： B08B7/04 ,  A46B13/00 ,  B24B51/00 ,  B08B3/10

    CPC分类号： H01L21/67046 ,  B08B1/04 ,  B08B11/02

    摘要： In one or more aspects, an apparatus for cleaning a substrate includes (1) a plurality of rollers adapted to contact and support the substrate in a horizontal orientation, and (2) at least one brush adapted to contact a major surface of the substrate while the substrate is supported by the plurality of rollers to clean the major surface of the substrate. At least one of the plurality of rollers is adapted to move between an opened position allowing the substrate to be loaded onto or unloaded from the plurality of rollers and a closed position in which the substrate is supported by the plurality of rollers. Numerous other aspects are provided.

    摘要翻译： 在一个或多个方面中，用于清洁基底的装置包括（1）多个辊，其适于以水平取向接触和支撑基底;以及（2）至少一个刷子，其适于接触基底的主表面，同时 基板由多个辊支撑以清洁基板的主表面。 所述多个辊中的至少一个适于在允许所述基底装载到所述多个辊子上或从所述多个辊子上卸载的打开位置和所述基板被所述多个辊支撑的关闭位置之间移动。 提供了许多其他方面。