发明申请
- 专利标题： Bolt and semiconductor manufacturing apparatus
- 专利标题（中）： 螺栓和半导体制造设备
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申请号： US11724223申请日： 2007-03-15
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公开(公告)号： US20070243057A1公开(公告)日： 2007-10-18
- 发明人: Yoshirou Shimada , Hiroki Etou , Ryou Kashihara
- 申请人： Yoshirou Shimada , Hiroki Etou , Ryou Kashihara
- 申请人地址： JP KAWASAKI
- 专利权人： NEC ELECTRONICS CORPORATION
- 当前专利权人： NEC ELECTRONICS CORPORATION
- 当前专利权人地址： JP KAWASAKI
- 优先权： JP2006-074101 20060317
- 主分类号： H01L21/04
- IPC分类号： H01L21/04 ; H01L23/544
摘要：
A bolt includes a main body and a spring pin. The main body includes a head and a shaft. The spring pin includes a base portion and an end portion. The shaft includes a portion of external thread and a hollow portion. The head includes a top surface and a hole opened in the top surface. The hole is connected to the hollow portion. The base portion is arranged in the hollow potion to move along an axis of the main body. The end portion is arranged in the hole to move along the axis. The spring pin is energized toward a side of the head such that the end portion protrudes beyond the top surface. The end portion is electrically connected to the portion of external thread.
公开/授权文献
- US07554104B2 Bolt and semiconductor manufacturing apparatus 公开/授权日：2009-06-30
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