Invention Application
- Patent Title: Substrate structure having a solder mask and a process for making the same
- Patent Title (中): 具有焊接掩模的基板结构及其制造方法
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Application No.: US11634059Application Date: 2006-12-06
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Publication No.: US20070243704A1Publication Date: 2007-10-18
- Inventor: Wei-Chang Tai , Chi-Chih Chu , Meng-Jung Chuang , Cheng-Yin Lee , Yao-Ting Huang , Kuang-Lin Lo
- Applicant: Wei-Chang Tai , Chi-Chih Chu , Meng-Jung Chuang , Cheng-Yin Lee , Yao-Ting Huang , Kuang-Lin Lo
- Priority: TW095113167 20060413
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
The present invention relates to a substrate structure having a solder mask and a process for making the same. The process comprises: (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. Whereby, the substrate structure of the invention can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.
Public/Granted literature
- US07473629B2 Substrate structure having a solder mask and a process for making the same Public/Granted day:2009-01-06
Information query
IPC分类:
