Invention Application
US20070246639A1 WAFER FOR MANUFACTURING IMAGE SENSORS, TEST KEY LAYOUT FOR DEFECTS INSPECTION, AND METHODS FOR MANUFACTURING IMAGE SENSORS AND FOR FORMING TEST KEY
有权
用于制造图像传感器的波形，用于缺陷检查的测试关键布局，以及用于制造图像传感器和形成测试键的方法
- Patent Title: WAFER FOR MANUFACTURING IMAGE SENSORS, TEST KEY LAYOUT FOR DEFECTS INSPECTION, AND METHODS FOR MANUFACTURING IMAGE SENSORS AND FOR FORMING TEST KEY
- Patent Title (中): 用于制造图像传感器的波形，用于缺陷检查的测试关键布局，以及用于制造图像传感器和形成测试键的方法
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Application No.: US11379229Application Date: 2006-04-19
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Publication No.: US20070246639A1Publication Date: 2007-10-25
- Inventor: Cheng-Hung Yu
- Applicant: Cheng-Hung Yu
- Main IPC: H01L27/00
- IPC: H01L27/00
Abstract:
A wafer for manufacturing image sensors is disclosed. The wafer includes an image sensor and a test key. The image sensor includes a plurality of micro-lenses; the test key includes a plurality of micro-lens samples for defects inspection. The arrangement of the micro-lens samples on the test key is substantially different from the arrangement of the micro-lenses on the image sensor. The arrangement of the micro-lens samples on the test key allows defects inspection to become less complicated.
Public/Granted literature
Information query
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