公开(公告)号：US20140027682A1

公开(公告)日：2014-01-30

申请号：US13561103

申请日：2012-07-30

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: G02B5/23 ,  B05D5/06

CPC classification number: G02B5/201 ,  G03F7/0007

Abstract: A method for manufacturing a color filter array having hybrid color filters includes providing a high-grade photoresist and a low-grade photoresist, forming a plurality of first color filters on a substrate, and forming a plurality of second color filters and a plurality of third color filters on the substrate. The first color filters include the high-grade photoresist, and the second color filters and the third color filters include the low-grade photoresist. The high-grade photoresist of the first color filters includes a first amount of large size pigments in one unit area and the low-grade photoresists of the second color filters and the third color filters include a second amount of large size pigments in one unit area. A ratio of the second amount to the first amount is equal to or larger than

Abstract translation: 一种制造具有混合滤色器的滤色器阵列的方法，包括提供高级光致抗蚀剂和低等级光致抗蚀剂，在衬底上形成多个第一滤色器，以及形成多个第二滤色器和多个第三滤色器 基底上的滤色器。 第一滤色器包括高级光致抗蚀剂，第二滤色器和第三滤色器包括低等级光致抗蚀剂。 第一滤色器的高级光致抗蚀剂包括在一个单位面积中的第一量的大尺寸颜料和第二滤色器的低等级光致抗蚀剂和第三滤色器在一个单位面积中包括第二量的大尺寸颜料 。 第二量与第一量的比例等于或大于

公开(公告)号：US20120261731A1

公开(公告)日：2012-10-18

申请号：US13084558

申请日：2011-04-12

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: H01L27/146

CPC classification number: H01L27/14627 ,  H01L27/14621 ,  H01L27/14685

Abstract: An image sensor is disclosed. The image sensor includes a substrate, at least a color filter, and a microlens disposed on the color filter. The substrate includes a passivation layer thereon, and the color filter is disposed on the passivation layer, in which the color filter is truncated.

Abstract translation: 公开了一种图像传感器。 图像传感器包括基板，至少滤色器和布置在滤色器上的微透镜。 衬底上包括钝化层，并且滤色器设置在钝化层上，滤色器被截断。

公开(公告)号：US08084289B2

公开(公告)日：2011-12-27

申请号：US12714093

申请日：2010-02-26

Applicant: Hsin-Ting Tsai ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Kun-Yen Hsu

Inventor： Hsin-Ting Tsai ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Kun-Yen Hsu

IPC: H01L21/00

CPC classification number: H01L27/14687 ,  H01L27/14636 ,  H01L27/14685

Abstract: A method of fabricating an image sensor device is provided. First, a substrate comprising a pixel array region and a pad region is provided. A patterned metal layer and a first planarization layer having an opening exposing the patterned metal layer in the pad region are sequentially formed on the substrate. A color filter array is formed on the first planarization layer in the pixel array region. A second planarization layer is formed to cover the color filter array and filled into the opening. A plurality of microlens is formed above the color filter array on the second planarization layer. A capping layer is conformally formed on the microlens and the second planarization layer. An etching step is performed to remove the capping layer and the second planarization layer in the opening so as to expose the patterned metal layer in the pad region.

Abstract translation: 提供一种制造图像传感器装置的方法。 首先，提供包括像素阵列区域和衬垫区域的衬底。 图案化金属层和具有露出焊盘区域中的图案化金属层的开口的第一平坦化层依次形成在基板上。 在像素阵列区域中的第一平坦化层上形成滤色器阵列。 形成第二平坦化层以覆盖滤色器阵列并填充到开口中。 在第二平坦化层上的滤色器阵列上方形成多个微透镜。 覆盖层保形地形成在微透镜和第二平坦化层上。 执行蚀刻步骤以去除开口中的覆盖层和第二平坦化层，以暴露焊盘区域中的图案化金属层。

公开(公告)号：US07834274B2

公开(公告)日：2010-11-16

申请号：US11554882

申请日：2006-10-31

Applicant: Ming-Huan Yang ,  Chung-Wei Wang ,  Chia-Chi Wu ,  Chao-Kai Cheng ,  Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Cheng-Po Yu ,  Cheng-Hung Yu

Inventor： Ming-Huan Yang ,  Chung-Wei Wang ,  Chia-Chi Wu ,  Chao-Kai Cheng ,  Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Cheng-Po Yu ,  Cheng-Hung Yu

IPC: H05K1/03

CPC classification number: H05K3/182 ,  H05K3/389 ,  H05K3/421 ,  H05K3/422 ,  H05K3/426 ,  H05K3/4661 ,  H05K2203/013 ,  H05K2203/0565 ,  H05K2203/0709 ,  Y10T29/49155

Abstract: A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.

Abstract translation: 一种通过喷墨印刷制造双面或多层印刷电路板（PCB）的方法，其包括提供基板，在所述基板的至少一侧上形成第一自组装膜（SAM），形成 在所述第一SAM上形成非粘性膜，在所述基底中形成至少一个微孔，在所述微孔的表面上形成第二SAM，在所述基底的至少一侧和所述微孔的表面上提供催化剂颗粒，以及 在基板上形成催化剂电路图案。

公开(公告)号：US07723150B2

公开(公告)日：2010-05-25

申请号：US12147940

申请日：2008-06-27

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: H01L21/00

CPC classification number: H01L27/14621 ,  H01L27/14627 ,  H01L27/14632

Abstract: A method for fabricating an image sensor, which includes the following steps, is provided. A semiconductor substrate including a sensor array, a pad and a passivation layer is provided, and the passivation layer covers the sensor array and the pad. An opening, which comprises tapered sidewalls not perpendicular to a bared surface of the pad, is formed in the semiconductor substrate to expose the pad. An under layer is formed on the semiconductor substrate, and covers the pad and the passivation layer. A color filter array is formed on the under layer and over the corresponding sensor array. A planar layer is formed on the color filter array. A portion of the under layer is removed to expose the pad. A plurality of U-lenses is formed on the planar layer.

Abstract translation: 提供了一种制造图像传感器的方法，其包括以下步骤。 提供了包括传感器阵列，焊盘和钝化层的半导体衬底，并且钝化层覆盖传感器阵列和衬垫。 在半导体衬底中形成包括不垂直于衬垫的裸露表面的锥形侧壁的开口以露出衬垫。 在半导体衬底上形成底层，覆盖衬垫和钝化层。 在下层和相应的传感器阵列上形成滤色器阵列。 平面层形成在滤色器阵列上。 下层的一部分被去除以暴露垫。 在平面层上形成多个U型透镜。

公开(公告)号：US20100089627A1

公开(公告)日：2010-04-15

申请号：US12333014

申请日：2008-12-11

Applicant: Han-Pei Huang ,  Cheng-Hung Yu

Inventor： Han-Pei Huang ,  Cheng-Hung Yu

IPC: H05K1/00 ,  C08J7/18 ,  B05D5/12 ,  C25D5/02 ,  B32B37/14 ,  H05K3/12 ,  H05K1/11

CPC classification number: H05K3/4644 ,  B33Y10/00 ,  B33Y80/00 ,  H05K1/0284 ,  H05K3/046 ,  H05K3/06 ,  H05K3/185 ,  H05K3/205 ,  H05K3/386 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/107 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multilayer three-dimensional circuit structure and a manufacturing method thereof are provided in the present invention. The manufacturing method includes following steps. First, a three-dimensional insulating structure is provided. A first three-dimensional circuit structure is then formed on a surface of the three-dimensional insulating structure. Next, an insulating layer covering the first three-dimensional circuit structure is formed. Thereafter, a second three-dimensional circuit structure is formed on the insulating layer. Subsequently, at least a conductive via penetrating the insulating layer is formed for electrically connecting the second three-dimensional circuit structure and the first three-dimensional circuit structure.

Abstract translation: 本发明提供了一种多层三维电路结构及其制造方法。 制造方法包括以下步骤。 首先，提供三维绝缘结构。 然后在三维绝缘结构的表面上形成第一三维电路结构。 接下来，形成覆盖第一三维电路结构的绝缘层。 此后，在绝缘层上形成第二三维电路结构。 随后，至少形成了穿过绝缘层的导电通孔，用于电连接第二三维电路结构和第一三维电路结构。

公开(公告)号：US20070281388A1

公开(公告)日：2007-12-06

申请号：US11456213

申请日：2006-07-10

Applicant: Cheng-Po Yu ,  Cheng-Hung Yu ,  Chi-Min Chang

Inventor： Cheng-Po Yu ,  Cheng-Hung Yu ,  Chi-Min Chang

IPC: H01L21/00 ,  H01L21/4763

CPC classification number: H05K3/243 ,  H01L21/6715 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/28 ,  H05K2201/0391 ,  H05K2203/013 ,  H05K2203/058

Abstract: A selective metal surface treatment process of a circuit board, which has a solder mask and a multiple of selective metal treatment surface areas, wherein the solder mask covers the surface of the circuit board but exposes the selective metal surface treatment areas, is provided. The selective metal surface treatment process includes using a printhead to selectively print a resist on a selective metal surface treatment area, performing a surface treatment of the other selective metal surface treatment areas, and removing the resist. A selective metal surface treatment apparatus used for performing the selective metal surface treatment process of the circuit board is also provided. Through the present invention, unnecessary waste of the materials in the process is reduced and the processing time is shortened.

Abstract translation: 提供具有焊接掩模和多个选择性金属处理表面积的电路板的选择性金属表面处理工艺，其中焊接掩模覆盖电路板的表面，但暴露选择性金属表面处理区域。 选择性金属表面处理方法包括使用打印头选择性地在选择性金属表面处理区域上印刷抗蚀剂，对其它选择性金属表面处理区域进行表面处理，并除去抗蚀剂。 还提供了用于执行电路板的选择性金属表面处理工艺的选择性金属表面处理装置。 通过本发明，可以减少处理过程中不必要的材料浪费，缩短处理时间。

公开(公告)号：US20060118698A1

公开(公告)日：2006-06-08

申请号：US11003515

申请日：2004-12-03

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: H01L27/00

CPC classification number: H01L27/14685 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L31/02162 ,  H01L31/0232

Abstract: An image sensor device including a substrate, a plurality of photo sensors, a dielectric layer, a planar layer, a plurality of color filters, a plurality of microlenses, and a shield layer is provided. The photo sensors are disposed in the substrate, and the dielectric layer is disposed over the photo sensors and the substrate. The planar layer is disposed over the dielectric layer. The color filters are disposed in the planar layer, wherein each of the color filters is disposed over each of the photo sensors. The microlenses are disposed over the planar layer, wherein each of the microlenses is disposed over each of the color filter. The shield layer including a plurality of openings is disposed in the planar layer and is disposed under or over the color filters, wherein each of the openings is disposed over each of the color filters.

Abstract translation: 提供了包括基板，多个光电传感器，电介质层，平面层，多个滤色器，多个微透镜以及屏蔽层的图像传感器装置。 光传感器设置在基板中，并且电介质层设置在光传感器和基板之上。 平面层设置在电介质层上。 滤色器设置在平面层中，其中每个滤色器设置在每个光传感器上。 微透镜设置在平面层上，其中每个微透镜设置在每个滤色器上。 包括多个开口的屏蔽层设置在平面层中并且设置在滤色器的下方或上方，其中每个开口设置在每个滤色器上。

公开(公告)号：US20050084778A1

公开(公告)日：2005-04-21

申请号：US10605677

申请日：2003-10-17

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: G01B11/00 ,  G03C5/00 ,  G03F7/00 ,  G03F9/00 ,  H01L21/00 ,  H01L21/027

CPC classification number: G03F9/7011 ,  G03F9/7019 ,  G03F9/7088

Abstract: A semiconductor wafer has at least one pre-layer on-wafer alignment mark (pre-layer on-wafer AM) on a top surface of the semiconductor wafer. A baseline check (BCHK) is performed to align a current-layer reticle AM on a current-layer reticle with the pre-layer on-wafer AM. By capturing and comparing signals of the current-layer reticle AM and the pre-layer on-wafer AM, a corresponding coordinate of the current-layer reticle to the semiconductor wafer is calibrated. Finally, a lithography process is performed to transfer the layout of the current-layer reticle AM to the top surface of the semiconductor wafer to form a corresponding current-layer on-wafer AM.

Abstract translation: 半导体晶片在半导体晶片的顶表面上具有至少一个晶片上对准标记（晶片上的预层）。 执行基线检查（BCHK）以将当前层掩模版上的当前层标线AM与晶片上的AM前层对准。 通过捕获和比较当前层标线AM和晶片AM上的晶片AM的信号，校准当前层掩模版对半导体晶片的对应坐标。 最后，进行光刻处理以将当前层标线AM的布局转移到半导体晶片的顶表面以形成相应的晶片上的电流层AM。

公开(公告)号：US6132113A

公开(公告)日：2000-10-17

申请号：US306260

申请日：1999-05-06

Applicant: Cheng-Hung Yu ,  Hsin-Min Lee ,  Yung-Chi Wu ,  Hsin-Ting Tsai

Inventor： Cheng-Hung Yu ,  Hsin-Min Lee ,  Yung-Chi Wu ,  Hsin-Ting Tsai

IPC: G03F7/30 ,  H01L21/00 ,  H01L21/687 ,  G03D5/00

CPC classification number: H01L21/68785 ,  G03F7/3021 ,  H01L21/6715 ,  H01L21/68792

Abstract: A developer cup. The developer cup includes a bed. A central spindle is vertically and rotatably coupled to a center of the bed through an end of the central spindle. A chuck is vertically coupled to an end of the central spindle opposite to the bed end. An upper coupling is coupled to the central spindle between the chuck and the bed, wherein the chuck. A lower coupling is moveably coupled to the central spindle between the upper coupling and the bed. The annular cup has an upper wheel and a lower wheel, wherein the upper wheel is aligned with the lower wheel, the upper wheel is coupled to the lower wheel through a plurality of the brackets, and the lower wheel is smaller than the upper wheel.

Abstract translation: 开瓶杯 显影杯包括一张床。 中心主轴通过中心主轴的一端垂直并可旋转地联接到床的中心。 卡盘垂直联接到与床端相对的中心轴的端部。 上连接件联接到卡盘和床之间的中心轴，其中卡盘。 下联接件可移动地联接到上联接器和床之间的中心主轴。 环形杯具有上轮和下轮，其中上轮与下轮对准，上轮通过多个托架联接到下轮，并且下轮小于上轮。