A method of manufacturing a glass circuit board includes the steps of: providing a glass substrate; forming a patterned metal layer on a surface of the glass substrate to expose a part of the surface; forming an insulating layer, with at least one opening, on the surface of the glass substrate and the patterned metal layer; and forming a metal connecting layer in the opening of the insulating layer. A glass circuit board manufactured by the method includes a glass substrate, a patterned metal layer, an insulating layer and a metal connecting layer. The glass substrate has a surface. The patterned metal layer is disposed on the surface of the glass substrate. The insulating layer is disposed on a part of the surface of the glass substrate and the patterned metal layer, and has at least one opening. The metal connecting layer is disposed in the opening of the insulating layer.