Invention Application
- Patent Title: MEMORY SYSTEM MOUNTED DIRECTLY ON BOARD AND ASSOCIATED METHOD
- Patent Title (中): 存储器系统直接安装在板上和相关方法上
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Application No.: US11745965Application Date: 2007-05-08
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Publication No.: US20070250658A1Publication Date: 2007-10-25
- Inventor: Jung-Bae LEE , Hoe-Ju CHUNG
- Applicant: Jung-Bae LEE , Hoe-Ju CHUNG
- Applicant Address: KR Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KP2003-28175 20030502
- Main IPC: G11C5/06
- IPC: G11C5/06

Abstract:
The invention provides an improved memory system that addresses signal degradation due to transmission line effects. The improved memory system includes a first buffer, at least one first memory device coupled to the first buffer, and a plurality of signal traces. The first buffer and memory device are mounted on a motherboard. Likewise, the plurality of signal traces is routed on the motherboard. Doing so eliminates stub loads that cause signal reflection that, in turn, result in signal degradation.
Public/Granted literature
- US07692983B2 Memory system mounted directly on board and associated method Public/Granted day:2010-04-06
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