Invention Application
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11790792Application Date: 2007-04-27
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Publication No.: US20070252168A1Publication Date: 2007-11-01
- Inventor: Yoshio Shimoida , Masakatsu Hoshi , Tetsuya Hayashi , Hideaki Tanaka , Shigeharu Yamagami
- Applicant: Yoshio Shimoida , Masakatsu Hoshi , Tetsuya Hayashi , Hideaki Tanaka , Shigeharu Yamagami
- Assignee: NISSAN MOTOR CO., LTD.
- Current Assignee: NISSAN MOTOR CO., LTD.
- Priority: JP2006-125422 20060428
- Main IPC: H01L29/74
- IPC: H01L29/74

Abstract:
An electrostatic discharge protection element and a protection resistor, which are formed on an N-drain region with a field oxide film interposed therebetween for the purpose of preventing electrical breakdown of a field effect transistor, are composed as a stacked bidirectional Zener diode of one or a plurality of N+ polycrystalline silicon regions of a first layer and a P+ polycrystalline silicon region of a second layer, and a stacked resistor of one or a plurality of N+ resistor layers of the first layer and an N+ resistor layer of the second layer, respectively. One end of the plurality of N+ polycrystalline silicon regions of the first layer is connected to an external gate electrode terminal, and the other end is connected to a source electrode. One end of the plurality of N+ resistor layers of the first layer is connected to a gate electrode, and the other end is connected to the external gate electrode terminal. Semiconductor regions of the first layer and the second layer are formed by using semiconductor films, which form a hetero semiconductor region and the gate electrode, respectively.
Public/Granted literature
- US07695997B2 Semiconductor device and manufacturing method thereof Public/Granted day:2010-04-13
Information query
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