发明申请
- 专利标题: Semiconductor device, and manufacturing method of semiconductor device
- 专利标题(中): 半导体器件及半导体器件的制造方法
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申请号: US11785965申请日: 2007-04-23
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公开(公告)号: US20070252209A1公开(公告)日: 2007-11-01
- 发明人: Shunpei Yamazaki , Yasuyuki Arai , Ikuko Kawamata
- 申请人: Shunpei Yamazaki , Yasuyuki Arai , Ikuko Kawamata
- 申请人地址: JP Atsugi-shi
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi
- 优先权: JP2006-126984 20060428
- 主分类号: H01L27/12
- IPC分类号: H01L27/12
摘要:
In order to form a plurality of semiconductor elements over an insulating surface, in one continuous semiconductor layer, an element region serving as a semiconductor element and an element isolation region having a function to electrically isolate element regions from each other by repetition of PN junctions. The element isolation region is formed by selective addition of an impurity element of at least one or more kinds of oxygen, nitrogen, and carbon and an impurity element that imparts an opposite conductivity type to that of the adjacent element region in order to electrically isolate elements from each other in one continuous semiconductor layer.
公开/授权文献
- US07875931B2 Semiconductor device with isolation using impurity 公开/授权日:2011-01-25
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