Invention Application
US20070253457A1 Semiconductor laser device and method for fabricating the same 审中-公开
半导体激光器件及其制造方法

  • Patent Title: Semiconductor laser device and method for fabricating the same
  • Patent Title (中): 半导体激光器件及其制造方法
  • Application No.: US11637098
    Application Date: 2006-12-12
  • Publication No.: US20070253457A1
    Publication Date: 2007-11-01
  • Inventor: Takayuki KashimaKouji Makita
  • Applicant: Takayuki KashimaKouji Makita
  • Priority: JP2006-121910 20060426
  • Main IPC: H01S5/00
  • IPC: H01S5/00
Semiconductor laser device and method for fabricating the same
Abstract:
A first semiconductor laser emitting light with a first wavelength and a second semiconductor laser emitting light with a second wavelength are formed on an identical substrate. Each of the semiconductor lasers includes: a doublehetero structure in which at least a first-conductivity-type cladding layer, an active layer and a second-conductivity-type cladding layer are stacked in this order; and a ridge waveguide including at least an upper portion of the second-conductivity-type cladding layer and a contact layer formed on the second-conductivity-type cladding layer. A first-conductivity-type current blocking layer is formed on both side walls of each of the ridge waveguides and on a portion around each of the ridge waveguides, and a leakage preventing layer is formed on the current blocking layer.
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