发明申请
- 专利标题: Apparatus and method for electrochemical processing of thin films on resistive substrates
- 专利标题(中): 电阻衬底薄膜电化学处理的装置和方法
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申请号: US11417146申请日: 2006-05-04
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公开(公告)号: US20070256937A1公开(公告)日: 2007-11-08
- 发明人: Veeraraghavan Basker , John Cotte , Hariklia Deligianni , Matteo Flotta
- 申请人: Veeraraghavan Basker , John Cotte , Hariklia Deligianni , Matteo Flotta
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 主分类号: C25D7/12
- IPC分类号: C25D7/12
摘要:
An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.
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