发明申请
US20070256937A1 Apparatus and method for electrochemical processing of thin films on resistive substrates 审中-公开
电阻衬底薄膜电化学处理的装置和方法

Apparatus and method for electrochemical processing of thin films on resistive substrates
摘要:
An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.
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