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20 条记录 (耗时 0.013 秒)

    Apparatus and method for electrochemical processing of thin films on resistive substrates
    5.
    发明申请
    Apparatus and method for electrochemical processing of thin films on resistive substrates 审中-公开
    电阻衬底薄膜电化学处理的装置和方法

    公开(公告)号：US20070256937A1

    公开(公告)日：2007-11-08

    申请号：US11417146

    申请日：2006-05-04

    申请人： Veeraraghavan Basker ,  John Cotte ,  Hariklia Deligianni ,  Matteo Flotta

    发明人： Veeraraghavan Basker ,  John Cotte ,  Hariklia Deligianni ,  Matteo Flotta

    IPC分类号： C25D7/12

    CPC分类号： C25D5/54 ,  C25D5/006 ,  C25D5/02 ,  C25D7/123 ,  C25D11/005 ,  C25D11/024 ,  C25D17/001 ,  C25F3/14 ,  H01L21/28079 ,  H01L21/2885

    摘要： An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.

    摘要翻译： 一种电化学方法，包括：提供与导电表面电接触的125mm或更大的半导体晶片，其中所述半导体晶片的至少一部分与电解液接触，所述半导体晶片用作第一电极; 在所述电解液中提供第二电极，所述第一和第二电极连接到电源的相对端; 并且在第一和第二电极之间施加用作为电流的光源照射半导体晶片的表面。 本发明还涉及一种包括光源和用于进行电化学过程的电化学组分的设备。

    Fixtures for processing a workpiece in a supercritical fluid
    6.
    发明授权
    Fixtures for processing a workpiece in a supercritical fluid 有权
    用于在超临界流体中加工工件的夹具

    公开(公告)号：US06579464B2

    公开(公告)日：2003-06-17

    申请号：US09903880

    申请日：2001-07-12

    申请人： John Michael Cotte ,  Matteo Flotta ,  Kenneth John McCullough ,  Wayne Martin Moreau ,  John P. Simons ,  Charles J. Taft

    发明人： John Michael Cotte ,  Matteo Flotta ,  Kenneth John McCullough ,  Wayne Martin Moreau ,  John P. Simons ,  Charles J. Taft

    IPC分类号： B44C122

    CPC分类号： B08B7/0021

    摘要： Fixtures and methods for clamping workpieces in a workplace to enable the optimized exposure thereof to a stream or flow of a supercritical fluid. Provided is a rotatably indexable chuck or locator mounting the workpiece and enabling orientating the latter in specific static pitch position within a high pressure vessel in order to subject the workpiece to a full frontal exposure to the supercritical fluid stream within the vessel. This mounting arrangement facilitates an optimum positioning of the workpiece being processed in the flow path of the supercritical fluid stream while oriented in selectively indexed rotational positions.

    摘要翻译： 用于在工作场所夹紧工件以使其优化地暴露于超临界流体的流或流的夹具和方法。 提供了一种安装工件的可转动的可转位的卡盘或定位器，并且能够将其定位在高压容器内的特定静态俯仰位置，以便使工件对容器内的超临界流体流进行完全正面暴露。 这种安装布置有助于正在处理的工件在超临界流体流的流动路径中的最佳定位，同时定向成选择性分度的旋转位置。

    Apparatus and method for electrochemical processing of thin films on resistive substrates
    7.
    发明授权
    Apparatus and method for electrochemical processing of thin films on resistive substrates 有权
    电阻衬底薄膜电化学处理的装置和方法

    公开(公告)号：US08303791B2

    公开(公告)日：2012-11-06

    申请号：US12198274

    申请日：2008-08-26

    申请人： Veeraraghavan S. Basker ,  John M. Cotte ,  Hariklia Deligianni ,  Matteo Flotta

    发明人： Veeraraghavan S. Basker ,  John M. Cotte ,  Hariklia Deligianni ,  Matteo Flotta

    IPC分类号： C25D7/12 ,  C25D5/00

    CPC分类号： C25D5/54 ,  C25D5/006 ,  C25D5/02 ,  C25D7/123 ,  C25D11/005 ,  C25D11/024 ,  C25D17/001 ,  C25F3/14 ,  H01L21/28079 ,  H01L21/2885

    摘要： An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.

    摘要翻译： 一种电化学方法，包括：提供与导电表面电接触的125mm或更大的半导体晶片，其中所述半导体晶片的至少一部分与电解液接触，所述半导体晶片用作第一电极; 在所述电解液中提供第二电极，所述第一和第二电极连接到电源的相对端; 并且在第一和第二电极之间施加用作为电流的光源照射半导体晶片的表面。 本发明还涉及一种包括光源和用于进行电化学过程的电化学组分的设备。

    Electrolytic processing apparatus and method
    9.
    发明申请
    Electrolytic processing apparatus and method 审中-公开
    电解处理装置及方法

    公开(公告)号：US20070034526A1

    公开(公告)日：2007-02-15

    申请号：US11202684

    申请日：2005-08-12

    申请人： Natsuki Makino ,  Junji Kunisawa ,  Keisuke Namiki ,  Yukio Fukunaga ,  Katsuyuki Musaka ,  Ray Fang ,  Emanuel Cooper ,  John Cotte ,  Hariklia Deligianni ,  Keith Kwietniak ,  Brett Baker-O'Neal ,  Matteo Flotta ,  Philippe Vereecken

    发明人： Natsuki Makino ,  Junji Kunisawa ,  Keisuke Namiki ,  Yukio Fukunaga ,  Katsuyuki Musaka ,  Ray Fang ,  Emanuel Cooper ,  John Cotte ,  Hariklia Deligianni ,  Keith Kwietniak ,  Brett Baker-O'Neal ,  Matteo Flotta ,  Philippe Vereecken

    IPC分类号： B23H3/00

    CPC分类号： B23H5/08 ,  C25F3/02 ,  C25F7/00

    摘要： An electrolytic processing apparatus can planarize uniformly over an entire surface of a substrate under a low pressure without any damages to the substrate. The electrolytic processing apparatus has a substrate holder configured to hold and rotate a substrate having a metal film formed on a surface of the substrate and an electrolytic processing unit configured to perform an electrolytic process on the substrate held by the substrate holder. The electrolytic processing unit has a rotatable processing electrode, a polishing pad attached to the rotatable processing electrode, and a pressing mechanism configured to press the polishing pad against the substrate. The electrolytic processing unit also has a liquid supply mechanism configured to supply an electrolytic processing liquid between the substrate and the rotatable processing electrode, a relative movement mechanism operable to move the substrate and the rotatable processing electrode relative to each other, and a power supply configured to applying a voltage between the rotatable processing electrode and the metal film of the substrate so that the rotatable processing electrode serves as a cathode and the metal film of the substrate serves as an anode.

    摘要翻译： 电解处理装置可以在低压下在基板的整个表面上均匀地平坦化，而不会对基板造成任何损坏。 所述电解处理装置具有基板保持件，所述基板保持器被构造成保持和旋转形成在所述基板的表面上的金属膜的基板和被配置为在由所述基板保持器保持的所述基板上进行电解处理的电解处理单元。 电解处理单元具有可旋转的处理电极，附接到可旋转处理电极的抛光垫，以及被配置为将抛光垫压靠在基板上的按压机构。 电解处理单元还具有：液体供给机构，被构造成在基板和可旋转处理电极之间提供电解处理液体;相对移动机构，其可操作以相对于彼此移动基板和可旋转处理电极;电源配置 在可旋转处理电极和基板的金属膜之间施加电压，使得可旋转处理电极用作阴极，并且基板的金属膜用作阳极。

    Vertical paddle plating cell
    10.
    发明授权
    Vertical paddle plating cell 失效
    垂直板式电镀槽

    公开(公告)号：US5516412A

    公开(公告)日：1996-05-14

    申请号：US441853

    申请日：1995-05-16

    申请人： Panayotis C. Andricacos ,  Kirk G. Berridge ,  John O. Dukovic ,  Matteo Flotta ,  Jose Ordonez ,  Helmut R. Poweleit ,  Jeffrey S. Richter ,  Lubomyr T. Romankiw ,  Otto P. Schick ,  Frank Spera ,  Kwong-Hon Wong

    发明人： Panayotis C. Andricacos ,  Kirk G. Berridge ,  John O. Dukovic ,  Matteo Flotta ,  Jose Ordonez ,  Helmut R. Poweleit ,  Jeffrey S. Richter ,  Lubomyr T. Romankiw ,  Otto P. Schick ,  Frank Spera ,  Kwong-Hon Wong

    IPC分类号： C25D17/00 ,  C25D21/10 ,  C25F7/00 ,  C25D17/06

    CPC分类号： C25D17/001 ,  C25D17/00 ,  C25D17/007 ,  C25D17/02 ,  C25D17/08 ,  C25D21/10 ,  C25F7/00 ,  Y10S204/07

    摘要： An electroplating cell includes a floor, ceiling, front wall, and back wall forming a box having first and second opposite open ends. A rack for supporting an article to be electroplated is removably positioned vertically to close the first open end and includes a thief laterally surrounding the article to define a cathode. An anode is positioned vertically to close the second open end, with the assembly defining a substantially closed, six-sided inner chamber for receiving an electrolyte therein for electroplating the article. The article and surrounding thief are coextensively aligned with the anode, with the floor, ceiling, front and back walls being effective for guiding electrical current flux between the cathode and the anode. In a preferred embodiment, the cell is disposed as an inner cell inside an outer cell substantially filled with the electrolyte, and a paddle is disposed inside the inner cell for agitating the electrolyte therein. The rack is removable and installable vertically upwardly which allows for automated handling thereof.

    摘要翻译： 电镀电池包括形成具有第一和第二相对开口端的盒子的地板，天花板，前壁和后壁。 用于支撑待电镀的物品的支架可移除地垂直地定位以闭合第一开口端，并且包括围绕物品的小偷以限定阴极。 阳极被垂直定位以闭合第二开口端，其中组件限定了基本封闭的六面内腔，用于在其中容纳用于电镀物品的电解质。 物品和周围的小偷与阳极共同对准，地板，天花板，前壁和后壁对于引导阴极和阳极之间的电流通量是有效的。 在一个优选的实施方式中，将电池作为内部电池设置在基本上充满电解质的外部电池中，并且在内部电池内设置有用于搅拌电解质的电极。 机架是可拆卸的，可垂直向上安装，允许其自动处理。