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发明申请
US20070260287A1 CHIP LEVEL BIOSTABLE INTERCONNECT FOR IMPLANTABLE MEDICAL DEVICES 有权
用于可植入医疗器械的芯片级可生物互连

  • 专利标题： CHIP LEVEL BIOSTABLE INTERCONNECT FOR IMPLANTABLE MEDICAL DEVICES
  • 专利标题（中）： 用于可植入医疗器械的芯片级可生物互连
  • 申请号： US11735832
    申请日： 2007-04-16
  • 公开(公告)号： US20070260287A1
    公开(公告)日： 2007-11-08
  • 发明人: Rogier Receveur
  • 申请人： Rogier Receveur
  • 主分类号： A61N1/00
  • IPC分类号： A61N1/00
CHIP LEVEL BIOSTABLE INTERCONNECT FOR IMPLANTABLE MEDICAL DEVICES
摘要：
A lead is connected to an integrated circuit in an implantable medical device in a lead bonding area that includes a lead-receiving recessed region. At least a portion of a lead conductor is bonded in the lead-receiving recessed region, making an electrical and mechanical connection to the integrated circuit that is strong and potentially biostable. In some embodiments, a filler material is provided around the recessed portion of the integrated circuit that receives the lead conductor, and a metal coating is provided around an outer surface of the filler material for additional mechanical stability.
摘要（中）：

引线与包括引线接收凹入区域的引线接合区域中的可植入医疗器件中的集成电路连接。 引线导体的至少一部分结合在引线接收凹入区域中，使得与集成电路的电连接和机械连接是强的并且具有潜在的生物稳定性。 在一些实施例中，填充材料设置在集成电路的凹陷部分周围，该集成电路的凹部接收引线导体，并且在填充材料的外表面周围设置金属涂层以用于额外的机械稳定性。

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