Invention Application
- Patent Title: Lithography Technique Using Silicone Molds
- Patent Title (中): 硅胶模具的平版印刷技术
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Application No.: US11659989Application Date: 2005-08-31
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Publication No.: US20070269747A1Publication Date: 2007-11-22
- Inventor: Maneesh Bahadur , Wei Chen , John Albaugh , Brian Harkness , James Tonge
- Applicant: Maneesh Bahadur , Wei Chen , John Albaugh , Brian Harkness , James Tonge
- International Application: PCT/US05/31150 WO 20050831
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004 ; G03F7/027
Abstract:
A method includes the steps of: A) filling a silicone mold having a patterned surface with a curable (meth)acrylate formulation, B) curing the curable (meth)acrylate formulation to form a patterned feature, C) separating the silicone mold and the patterned feature, optionally D) etching the patterned feature, and optionally E) repeating steps A) to D) reusing the silicone mold. The curable (meth)acrylate formulation contains a fluorofunctional (meth)acrylate, a (meth)acrylate, and a photoinitiator.
Information query
