发明申请
- 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- 专利标题(中): 半导体器件及其制造方法
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申请号: US11549983申请日: 2006-10-17
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公开(公告)号: US20070272935A1公开(公告)日: 2007-11-29
- 发明人: Yoshihiko HANAMAKI , Kenichi ONO , Masayoshi TAKEMI , Makoto TAKADA
- 申请人: Yoshihiko HANAMAKI , Kenichi ONO , Masayoshi TAKEMI , Makoto TAKADA
- 申请人地址: JP Tokyo
- 专利权人: MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人: MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2006-148779 20060529
- 主分类号: H01L33/00
- IPC分类号: H01L33/00 ; H01L21/00
摘要:
A laser diode includes a first n-cladding layer disposed on and lattice-matched to an n-semiconductor substrate, wherein the first n-cladding layer is n-AlGaInP or n-GaInP; a second n-cladding layer of n-AlGaAs supported by the first n-cladding layer; and an inserted layer disposed between the first n-cladding layer and the second n-cladding layer, wherein the inserted layer includes the same elements as the first n-cladding layer, the inserted layer has the same composition ratios of Al and Ga (and P) as the first n-cladding layer, and the inserted layer contains a lower composition ratio of In than the first n-cladding layer.
公开/授权文献
- US07394114B2 Semiconductor device and manufacturing method therefor 公开/授权日:2008-07-01
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