Invention Application
- Patent Title: Method For Joining Joint Parts To Hollow Profiles
- Patent Title (中): 将连接件连接到空心型材的方法
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Application No.: US10581794Application Date: 2004-12-03
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Publication No.: US20070274775A1Publication Date: 2007-11-29
- Inventor: Konrad Eipper
- Applicant: Konrad Eipper
- Applicant Address: DE Stuttgart 70546
- Assignee: DaimlerChrysler AG
- Current Assignee: DaimlerChrysler AG
- Current Assignee Address: DE Stuttgart 70546
- Priority: DE10356533.7 20031204
- International Application: PCT/EP04/13792 WO 20041203
- Main IPC: F16B17/00
- IPC: F16B17/00 ; B21D39/04

Abstract:
The present invention relates to a method for joining at least one joint part (3), provided with a through-opening (4), to a hollow profile (1), the joint part (3) being pushed with its through-opening (4) onto the hollow profile (1) up to a joint point (2), and the hollow profile (1) being expanded at least at the joint point (2). In order to improve the durability of the connection between joint part (3) and hollow profile (1), an adhesive (11) is arranged between an inner side (6) of the joint part (3) and an outer side (5) of the hollow profile (1) before the expansion in such a way that the adhesive (11) adheres to the inner side (6) and to the outer side (5) in the region of the joint point (2) after the expansion.
Information query