发明申请
- 专利标题： Light Beam Bonding
- 专利标题（中）： 光束粘合
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申请号： US10593765申请日： 2005-03-31
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公开(公告)号： US20070278278A1公开(公告)日： 2007-12-06
- 发明人: Kazuya Okano
- 申请人： Kazuya Okano
- 优先权： JP2004-107905 20040331
- 国际申请： PCT/JP05/06285 WO 20050331
- 主分类号： G03F1/00
- IPC分类号： G03F1/00 ; B23K31/02 ; H01R11/09
摘要：
A method for performing soldering using a light beam, and a mask for blocking the light beam are provided. A connecting method is provided, being a method for connecting conducting lines and contacts using a light beam, including a step for installing conducting lines in regions wherein contacts are formed, a step for supplying solder to regions wherein contacts are formed, a step for installing a mask that shields at least a portion of the contacts from a light beam, and a step for connecting conducting lines and contacts by melting solder by illuminating with a light beam.
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