A method of dielectrically embossing material comprising the steps of providing a dielectric embossing machine having a dielectric tool, providing a coloring agent, providing a material, applying the coloring agent to the dielectric tool, placing the material in the dielectric embossing machine, bringing the dielectric tool into contact with the material, energizing the dielectric tool, dielectrically embossing the material, de-energizing the dielectric tool, allowing the material and the coloring agent to cool, and backing the dielectric tool away from the material.