发明申请
- 专利标题： WIRE BONDING METHOD FOR FORMING LOW-LOOP PROFILES
- 专利标题（中）： 用于形成低环形轮廓的线接合方法
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申请号： US11753957申请日： 2007-05-25
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公开(公告)号： US20070284416A1公开(公告)日： 2007-12-13
- 发明人: Yam Mo WONG , Mow Huat GOH
- 申请人： Yam Mo WONG , Mow Huat GOH
- 主分类号： A47J36/02
- IPC分类号： A47J36/02
摘要：
A method of forming a wire bond with a bonding tool is provided that comprises the steps of forming a ball bond onto a bonding surface, raising the bonding tool away from the ball bond to form a neck portion integrated with a top of the ball bond, locating a circumference of a tip of the bonding tool onto the neck portion, pressing the neck portion with the circumference of the tip to form a depression in the neck portion without bonding the neck portion to the ball bond, and thereafter raising the bonding tool away from the ball bond.
公开/授权文献
- US07780064B2 Wire bonding method for forming low-loop profiles 公开/授权日：2010-08-24
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