公开(公告)号：US20070284416A1

公开(公告)日：2007-12-13

申请号：US11753957

申请日：2007-05-25

申请人： Yam Mo WONG ,  Mow Huat GOH

发明人： Yam Mo WONG ,  Mow Huat GOH

IPC分类号： A47J36/02

CPC分类号： B23K20/007 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method of forming a wire bond with a bonding tool is provided that comprises the steps of forming a ball bond onto a bonding surface, raising the bonding tool away from the ball bond to form a neck portion integrated with a top of the ball bond, locating a circumference of a tip of the bonding tool onto the neck portion, pressing the neck portion with the circumference of the tip to form a depression in the neck portion without bonding the neck portion to the ball bond, and thereafter raising the bonding tool away from the ball bond.

摘要翻译： 提供了一种与焊接工具形成引线接合的方法，其包括以下步骤：在接合表面上形成球接合，使接合工具远离球接头，形成与球接头顶部整合的颈部， 将接合工具的尖端的圆周定位在颈部上，用颈部的周边按压颈部以在颈部形成凹陷，而不将颈部粘合到球形接合处，然后将接合工具提升离开 从球的债券。

公开(公告)号：US20080099531A1

公开(公告)日：2008-05-01

申请号：US11554108

申请日：2006-10-30

申请人： Yam Mo WONG ,  Ka Shing Kenny KWAN

发明人： Yam Mo WONG ,  Ka Shing Kenny KWAN

IPC分类号： B23K1/00 ,  B23K37/00

CPC分类号： B23K20/004 ,  B23K20/14 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00

摘要： An apparatus is provided for supplying a shielding gas during the bonding of wires to electronic components with a bonding tool comprising a horn and a capillary. The apparatus comprises a main body with an elongated slot having a width that extends into the main body from a side of the main body generally in a first direction and the slot also extends from a top surface to a bottom surface of the main body in a second direction perpendicular to the first direction for the width of the slot. The slot is sized to receive a tip of the capillary which is operable to pass through the slot in the second direction. A gas outlet, which may be formed inside the slot, supplies shielding gas into the slot.

摘要翻译： 提供一种用于在使用包括喇叭和毛细管的接合工具将电线连接到电子部件期间提供保护气体的装置。 该装置包括具有细长狭槽的主体，该细长槽的宽度大致沿第一方向从主体的一侧延伸到主体中，并且槽也从主体的顶表面延伸到底表面 对于槽的宽度，垂直于第一方向的第二方向。 狭槽的尺寸被设计成接收毛细管的尖端，其可操作以沿着第二方向穿过狭槽。 可以形成在槽内的气体出口将保护气体供应到槽中。

公开(公告)号：US20080093004A1

公开(公告)日：2008-04-24

申请号：US11843012

申请日：2007-08-22

申请人： Yam Mo WONG ,  Keng Yew James SONG ,  Ka Shing Kenny KWAN

发明人： Yam Mo WONG ,  Keng Yew James SONG ,  Ka Shing Kenny KWAN

IPC分类号： H01B13/00 ,  B65C9/26

CPC分类号： B23K37/047 ,  B23K20/004 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/7865 ,  H01L2224/85121 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A large electronic device having a bonding area on one side that comprises first and second portions may be bonded by first locating the first portion but not the second portion of the electronic device for bonding by a bonding tool. After the first portion of the electronic device has been bonded, the electronic device is conveyed to a rotary platform that is rotatable along a substantially horizontal plane. The electronic device is rotated on the rotary platform to change the respective positions of the bonded first portion and unbonded second portion of the electronic device, before the electronic device is conveyed to the bonding tool such that the second portion of the electronic device is located for bonding by the bonding tool. The second portion of the electronic device may then be bonded.

摘要翻译： 具有包括第一和第二部分的一侧上具有接合区域的大型电子设备可以通过首先定位用于通过接合工具进行接合的电子设备的第一部分而不是第二部分来进行接合。 在电子设备的第一部分已经结合之后，电子设备被传送到可沿着基本上水平的平面旋转的旋转平台。 在电子设备被传送到接合工具之前，电子设备在旋转平台上旋转以改变接合的第一部分和未结合的电子设备的第二部分的位置，使得电子设备的第二部分位于 通过粘合工具进行粘合。 然后可以结合电子设备的第二部分。

公开(公告)号：US20080121679A1

公开(公告)日：2008-05-29

申请号：US11563068

申请日：2006-11-24

申请人： Hing Leung Marchy LI ,  Boon June Edwin YEAP ,  Ka Shing Kenny KWAN ,  Man CHAN ,  Yam Mo WONG

发明人： Hing Leung Marchy LI ,  Boon June Edwin YEAP ,  Ka Shing Kenny KWAN ,  Man CHAN ,  Yam Mo WONG

IPC分类号： B23K20/12

CPC分类号： B06B3/00 ,  H01L24/78 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2924/00

摘要： A transducer is provided that comprises a horn that is configured to transmit vibrations along its length during operation in the form of an oscillatory waveform, such oscillatory waveform having a plurality of vibration nodal points. An ultrasonic generator is coupled to one end of the horn and a bonding tool is coupled to an opposite end of the horn for performing bonding operations. A first flange structure is located along the length of the horn at a first vibration nodal point for mounting the transducer, and a second flange structure is located along the length of the horn at a second vibration nodal point for mounting the transducer, such that the second flange structure is separated from the first flange structure by a distance of at least two consecutive vibration nodal points.

摘要翻译： 提供了一种换能器，其包括喇叭，该喇叭被配置为以振荡波形的形式在其操作期间沿其长度传递振动，这种振荡波形具有多个振动节点。 超声波发生器耦合到喇叭的一端，并且接合工具耦合到喇叭的相对端，用于执行接合操作。 第一凸缘结构沿着喇叭的长度位于第一振动节点处，用于安装换能器，并且第二凸缘结构沿着喇叭的长度设置在第二振动节点处，用于安装换能器，使得 第二凸缘结构与第一凸缘结构隔开至少两个连续振动节点的距离。

公开(公告)号：US20080092370A1

公开(公告)日：2008-04-24

申请号：US11550855

申请日：2006-10-19

申请人： Yam Mo WONG ,  Keng Yew James SONG ,  Ka Shing Kenny KWAN

发明人： Yam Mo WONG ,  Keng Yew James SONG ,  Ka Shing Kenny KWAN

IPC分类号： H01L21/02

CPC分类号： H01L21/67144 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/52 ,  H01L2924/00 ,  H01L2924/00015

摘要： A bonding apparatus is provided which includes a device handler for handling electronic devices, the bonding apparatus including a bonding tool at which the electronic devices are locatable for bonding. A storage assembly is provided for storing multiple electronic devices and a conveying track is further provided for conveying electronic devices towards and away from the bonding tool. The device handler includes a rotary platform for holding an electronic device, and which is operable between an orientation wherein the rotary platform is aligned with the conveying track for transferring an electronic device between the rotary platform and the conveying track, and another orientation wherein the rotary platform is aligned with the storage assembly for transferring an electronic device between the rotary platform and the storage assembly.

摘要翻译： 提供了一种接合装置，其包括用于处理电子装置的装置处理器，所述接合装置包括接合工具，电子装置可定位在该接合工具上用于接合。 提供存储组件用于存储多个电子设备，并且进一步提供用于将电子设备朝向和远离粘合工具传送的输送轨道。 设备处理器包括用于保持电子设备的旋转平台，并且其可旋转平台与用于在旋转平台和输送轨道之间传送电子设备的输送轨道对准的方向之间操作，并且另一方向 平台与用于在旋转平台和存储组件之间传送电子设备的存储组件对准。

公开(公告)号：US20130240605A1

公开(公告)日：2013-09-19

申请号：US13420739

申请日：2012-03-15

申请人： Yam Mo WONG ,  Ka Shing KWAN ,  Hing Leung LI ,  Xiang Chao LI

发明人： Yam Mo WONG ,  Ka Shing KWAN ,  Hing Leung LI ,  Xiang Chao LI

IPC分类号： B23K1/06

CPC分类号： B23K20/007 ,  B06B3/00 ,  B23K20/002 ,  B23K20/004 ,  B23K20/005 ,  B23K20/10 ,  B23K20/103 ,  B23K20/106 ,  H01L24/78 ,  H01L24/80 ,  H01L24/85 ,  H01L2224/78301 ,  H01L2224/78308 ,  H01L2224/78343 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2924/00

摘要： Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.

摘要翻译： 公开了一种用于将换能器安装到引线接合器的接合头的装置。 特别地，当在半导体封装内的不同位置之间形成电互连时，引线接合器的结合头可用于机械地驱动换能器。 具体地，该装置包括：i）具有用于连接到换能器的连接器的弯曲结构，该弯曲结构被构造成弯曲; 以及ii）附接到所述弯曲结构的至少一个致动器，所述至少一个致动器可操作以弯曲所述弯曲结构，从而引起经由所述连接器连接到其上的所述换能器的位移。

公开(公告)号：US20080272178A1

公开(公告)日：2008-11-06

申请号：US11744492

申请日：2007-05-04

申请人： Ka Shing Kenny KWAN ,  Yue ZHANG ,  Yam Mo WONG

发明人： Ka Shing Kenny KWAN ,  Yue ZHANG ,  Yam Mo WONG

IPC分类号： B23K37/00

CPC分类号： B23K20/004 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/78302 ,  H01L2224/78631 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10S228/904 ,  H01L2224/48 ,  H01L2924/00

摘要： A wire tensioner is provided for a wire bonder, the wire tensioner comprising a tubular body having a bore through which bonding wire is receivable and a bore outlet at an end of the tubular body from which the bonding wire is extendable towards a bonding tool. A chamber is formed next to the bore outlet that substantially encloses the bore outlet, the chamber including an air inlet connected to it that is operative to introduce clean air into the chamber. A vacuum outlet is connected to a side of the tubular body and is in fluid communication with the chamber via the bore, the vacuum outlet being operative to draw air from the bore outlet through the bore whereby to pull the wire.

摘要翻译： 为引线接合器提供线张紧器，线张紧器包括管状体，其具有可接收接合线的孔，管状体的端部处的孔出口，接合线可以从该孔延伸到接合工具。 在孔出口旁边形成有一个大致封闭孔出口的腔室，该腔室包括连接到其上的空气入口，该进气口用于将清洁空气引入腔室。 真空出口连接到管状体的一侧并且经由孔与腔室流体连通，真空出口可操作以从孔出口通过孔抽出空气，从而拉动线。