发明申请
US20070287220A1 Organic semiconductor materials using stacking-inducing compounds, compositions comprising such materials, organic semiconductor thin films formed using such compositions, and organic electronic devices incorporating such thin films 有权
使用堆积诱导化合物的有机半导体材料,包含这些材料的组合物,使用这种组合物形成的有机半导体薄膜,以及掺入这种薄膜的有机电子器件

  • 专利标题: Organic semiconductor materials using stacking-inducing compounds, compositions comprising such materials, organic semiconductor thin films formed using such compositions, and organic electronic devices incorporating such thin films
  • 专利标题(中): 使用堆积诱导化合物的有机半导体材料,包含这些材料的组合物,使用这种组合物形成的有机半导体薄膜,以及掺入这种薄膜的有机电子器件
  • 申请号: US11700028
    申请日: 2007-01-31
  • 公开(公告)号: US20070287220A1
    公开(公告)日: 2007-12-13
  • 发明人: Eun Jeong JeongBang Lin Lee
  • 申请人: Eun Jeong JeongBang Lin Lee
  • 优先权: KR10-2006-0050943 20060607
  • 主分类号: H01B1/12
  • IPC分类号: H01B1/12 H01L27/01
Organic semiconductor materials using stacking-inducing compounds, compositions comprising such materials, organic semiconductor thin films formed using such compositions, and organic electronic devices incorporating such thin films
摘要:
Disclosed are organic semiconductor materials, including mixtures of relatively low molecular weight aromatic ring compounds, in which at least one nitrogen atom or oxygen atom is present as a heteroatom in the aromatic ring compounds for forming hydrogen bonds between the heteroatom(s) and adjacent molecules and thereby increase intermolecular stacking. Organic semiconductor layers formed using such organic semiconductor materials will, accordingly, exhibit increased intermolecular stacking and associated improvements in one or more electrical properties of the semiconductor layer. Organic thin film transistors incorporating such organic semiconductor layers will tend to exhibit improved transistor properties including, for example, increased carrier mobility and reduced off-state leakage current. Further, the organic semiconductor layers may be manufactured using conventional room temperature processes, for example, spin coating or printing, thereby simplifying the fabrication process.
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