发明申请
US20070287316A1 Method for manufacturing conductive plates, applicable for covering floors or walls, conductive plate and injecting machine 审中-公开
制造导电板的方法,适用于覆盖地板或墙壁,导电板和注射机

  • 专利标题: Method for manufacturing conductive plates, applicable for covering floors or walls, conductive plate and injecting machine
  • 专利标题(中): 制造导电板的方法,适用于覆盖地板或墙壁,导电板和注射机
  • 申请号: US11803897
    申请日: 2007-05-16
  • 公开(公告)号: US20070287316A1
    公开(公告)日: 2007-12-13
  • 发明人: Francois RodriguezXavier Blanch Andreu
  • 申请人: Francois RodriguezXavier Blanch Andreu
  • 优先权: ESES200601241 20060516
  • 主分类号: H01R13/15
  • IPC分类号: H01R13/15
Method for manufacturing conductive plates, applicable for covering floors or walls, conductive plate and injecting machine
摘要:
A method for manufacturing conductive plates, applicable for covering floors or walls, a conductive plate and an injecting machine is provided. The method comprises a) carrying out a polymer concrete mixture or mortar, b) introducing said mortar in a hollow mold with a shape of one of said plates to be obtained when said mortar solidifies, c) making at least one through hole through said mortar deposited in said mold, and d) injecting an electrically conductive ink in said hole, which is at least one in number. A second aspect of the invention relates to a conductive plate manufactured in accordance with the method. A third aspect of the invention relates to an ink injecting machine which can be used to carry out part of the method proposed by the first aspect of the invention.
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