Method for manufacturing conductive plates, applicable for covering floors or walls, conductive plate and injecting machine
    1.
    发明申请
    Method for manufacturing conductive plates, applicable for covering floors or walls, conductive plate and injecting machine 审中-公开
    制造导电板的方法,适用于覆盖地板或墙壁,导电板和注射机

    公开(公告)号:US20070287316A1

    公开(公告)日:2007-12-13

    申请号:US11803897

    申请日:2007-05-16

    IPC分类号: H01R13/15

    摘要: A method for manufacturing conductive plates, applicable for covering floors or walls, a conductive plate and an injecting machine is provided. The method comprises a) carrying out a polymer concrete mixture or mortar, b) introducing said mortar in a hollow mold with a shape of one of said plates to be obtained when said mortar solidifies, c) making at least one through hole through said mortar deposited in said mold, and d) injecting an electrically conductive ink in said hole, which is at least one in number. A second aspect of the invention relates to a conductive plate manufactured in accordance with the method. A third aspect of the invention relates to an ink injecting machine which can be used to carry out part of the method proposed by the first aspect of the invention.

    摘要翻译: 提供一种制造适用于覆盖地板或墙壁的导电板的方法,导电板和注射机。 该方法包括:a)进行高分子混凝土混合物或砂浆,b)将所述砂浆引入中空模具中,当所述砂浆固化时,将其形成为所述板之一,c)至少通过所述砂浆至少一个通孔 沉积在所述模具中,以及d)在所述孔中注入至少一个数量的导电油墨。 本发明的第二方面涉及根据该方法制造的导电板。 本发明的第三方面涉及一种可用于执行由本发明的第一方面提出的方法的一部分的喷墨机。