发明申请
- 专利标题: SUBSTRATE ASSEMBLING APPARATUS AND SUBSTRATE ASSEMBLING METHOD USING THE SAME
- 专利标题(中): 基板组装装置和基板组装方法
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申请号: US11748525申请日: 2007-05-15
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公开(公告)号: US20070289711A1公开(公告)日: 2007-12-20
- 发明人: Takuya Kaizu , Hiroaki Imai , Masayuki Saito
- 申请人: Takuya Kaizu , Hiroaki Imai , Masayuki Saito
- 优先权: JP2006-137211 20060517
- 主分类号: B32B37/10
- IPC分类号: B32B37/10
摘要:
A technique which solves the problem of conventional laminating apparatuses that a substrate may be deformed when released by pushing lift pins against the substrate held on an adhesive member by suction. An upper table inside a chamber has, on its substrate holding face, an elastic plate provided with an elastic body, a vacuum suction means and a purge gas blow means. A plurality of adhesive pins are provided on an adhesive pin plate which can move up and down independently from the upper table. The upper table and the elastic plate have through holes through which the adhesive pins can move and the adhesive pins have adhesion means at their tips.
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