发明申请
US20070290244A1 METHOD FOR PROCESSING A SCRATCHED SURFACE, PARTICULARLY A GLASS PLATE OF A SEMICONDUCTOR WAFER
审中-公开
用于处理切割表面的方法，特别是半导体波形的玻璃板
- 专利标题： METHOD FOR PROCESSING A SCRATCHED SURFACE, PARTICULARLY A GLASS PLATE OF A SEMICONDUCTOR WAFER
- 专利标题（中）： 用于处理切割表面的方法，特别是半导体波形的玻璃板
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申请号： US11753264申请日： 2007-05-24
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公开(公告)号： US20070290244A1公开(公告)日： 2007-12-20
- 发明人: Caroline Hernandez
- 申请人： Caroline Hernandez
- 申请人地址： FR Rousset 13790
- 专利权人： STMICROELECTRONICS ROUSSET SAS
- 当前专利权人： STMICROELECTRONICS ROUSSET SAS
- 当前专利权人地址： FR Rousset 13790
- 优先权： FR06/04770 20060526
- 主分类号： H01L31/062
- IPC分类号： H01L31/062 ; B05D3/12 ; H01L21/00 ; H01L21/31
摘要：
A method for processing a scratched surface of a material that is transparent to electromagnetic radiation includes a step of depositing onto the scratched surface at least one layer of a polymer material having substantially the same optical index as the material having the scratched surface, so as to fill in the scratches, and a step of polymerizing the polymer material. The method may be applied to the manufacture of semiconductor wafers including imagers.
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